Henkel Surface Mount Adhesives

Company Information:

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer

1-714-368-8000

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Company Postings:

(13) products in the catalog

(11) technical library articles

(61) news releases

Name:	Henkel Surface Mount Adhesives
Category:	Materials
Offered by:	Henkel Electronic Materials

Henkel Surface Mount Adhesives Description:

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) applications.

Henkel offers a wide range of Chip bonder and Eccobond products to meet the diversity and challenges of today’s manufacturing requirements. Developed using in-process analysis, Henkel’s surface mount adhesives can address high-speed assembly processes while delivering lead-free compatibility with no loss in productivity. The portfolio includes formulations for low-temperature screen printing and dispensing.

Henkel's LOCTITE Sufrace Mount Adhesive Products:		Cure Schedules	Application
Dispense Adhesives
LOCTITE 3609	For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.	90 seconds @ 150°C 3 – 4 minutes @ 125°C	General-purpose syringe dispense.
LOCTITE 3619	For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.	2 minutes @ 100°C 5 – 6 minutes @ 85°C	High speed syringe dispense 40,000+ DPH capable.
LOCTITE 3621	For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Suited where dispense speeds greater than 35,000 dots/h are required.	90 seconds @ 150°C 3 – 4 minutes @ 125°C	Very high speed syringe dispense 47,000 DPH capable.
Screen Print / Pin Transfer Adhesives
LOCTITE 3611	Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited where very fast cure is required on high speed SMT lines. Very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.	90 seconds @ 150°C	Stencil print (20 – 150 mm/s)
LOCTITE 3612	Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where medium print speeds, high dot profile, high wet strength and good electrical characteristics are required.	90 seconds @ 150°C	Stencil print (20 – 150 mm/s)
LOCTITE 3616	Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.	90 seconds @ 150°C 2 – 3 minutes @ 125°C	Stencil print (60 – 150 mm/s)