Henkel Electronics Assembly Film Adhesives
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Henkel Electronics Assembly Film Adhesives |
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Henkel Electronics Assembly Film Adhesives Description:
The Henkel line of adhesives includes high temperature electrically conductive epoxy products for every customer’s needs.
As the leader in thermal film formulation technology, Henkel has developed a wide variety of film materials for multiple applications. Whether you’re seeking high thermal conductivity, electrical conductivity, insulation performance or a combination thereof, Henkel has a thermal film solution for just about any application.
Their advantages are many, especially when there is a requirement for bonding large areas or complex parts together. Thermal adhesive films are most often found in the defense and automotive markets, and the advantages they deliver can extend to any application where robust thermal and electrical performance, void-free bond lines and controlled thicknesses are required. Supplied in custom, precut formats for the applications in which they will be used, films aren’t subject to the same flow concerns associated with pastes. The film is placed onto the backside of the device, aligned and attached to its heat sink or chassis, following which pressure and heat is applied to cure the material. Films are remarkably simple to use and the reliability they provide is, in many cases, superior to alternative products.
Manufacturers of smaller, highly complex devices also find that films deliver a far more elegant, reliable and user-friendly alternative to paste-based mediums. As compared to thermal paste adhesives, films offer a cleaner, no-waste, easily processed solution with a lower total cost of ownership. And, when it comes to stacking up against solder as a thermal solution, films also prove their superiority for certain applications.
Henkel's Electronics Assembly Film Adhesive Products: |
Tensile Strength, Lap Shear (PSI) |
Thermal Conductivity (W/mK) |
Volume Resistivity (OHM.CM) |
Primary Cure Cycle |
Film Thickness Available (MILS) |
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Adhesive Films - Electricaly Insulating |
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Adhesive film designed for substrate attach and sealing microelectronic packages. Good for gold-plated and difficult-to-bond surfaces. |
5,700 |
0.2 |
1 x 1014 |
30 minutes @ 150°C |
4, 5, 6 |
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Flexible unsupported adhesive film designed to produce tough, resilient bonds between materials with differing coefficients of thermal expansion. Also useful for bonding thin, flexible materials, where good peel strength is required. |
5,000 |
N/A |
N/A |
10 minutes |
3, 5, 7, 9 |
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Designed for substrate attach and heat sink bonding and for bonding materials with severely mismatched coefficients of thermal expansion. |
4,345 |
0.9 |
9.1 x 1012 |
30 minutes @ 150°C |
4, 5, 12 |
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Electrical insulation film with high thermal conductivity and adhesion strength. Uniform bondline control. |
3,000 |
1 |
1 x 1013 |
30 minutes @ 150°C |
2, 3, 4, 5, 6 |
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Epoxy film designed for bonding dissimilar materials with mismatched coefficients of thermal expansion. |
2,300 |
0.2 |
N/A |
3 hours @ 90°C |
4, 5, 8 |
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A high purity adhesive with excellent adhesion to goldplated surfaces, particularly suited for use in hermetic packages. Certified to MIL-STD-883, Method 511. NASA outgassing approved. |
3,000 |
0.7 |
8 x 1014 |
1 hour @ 150°C |
4, 5, 6 |
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Adhesive Films - Electricaly Conductive |
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Epoxy adhesive film ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Certified to MIL-STD-883, Method 511. NASA outgassing approved. |
2,000 |
6.5 |
0.0005 |
30 minutes @ 150°C |
2 to 6 mils |
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Designed for microelectronic applications that require electrical conductivity. Moisture resistant. |
3,000 |
1 |
0.001 |
30 minutes @ 150°C |
Carrier Film Thickness 1 mil |
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Designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane. |
2,000 |
1.6 |
0.001 |
1 hour @ 150°C |
Carrier Film Thickness 1 mil |
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Unsupported epoxy adhesive film is ideal for bonding “hot” devices onto heat sinks in applications where electrical insulation is not required. Microwave and heat sink applications. |
2,500 |
1 |
0.004 |
30 minutes @ 150°C |
2 to 6 mils |
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For electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance. |
3,400 |
7 |
0.0002 |
30 minutes @ 150°C |
2 or 4 mils (±0.5 mils) |
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Henkel Electronics Assembly Film Adhesives was added in Dec 2013
Henkel Electronics Assembly Film Adhesives has been viewed 1695 times
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