Surface Mount Technology companies
Global supplier of Automated Optical Inspection and Solder Paste Inspection Systems to the Electronics Manufacturing Industry.
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Brian D’Amico, president of MIRTEC Corp attributes this remarkable growth to the industry wide acceptance of MIRTEC’s two (2) new award winning Automated Optical Inspection platforms; “MIRTEC has recently introduced our most technologically advanced AOI platform to the PCB manufacturing industry. Fully configured, our MV-7L in line AOI system provides one top down four (4) mega pixel digital color camera and four two (2) mega pixel side view cameras thus providing the necessary resolution to inspect 01005 components. The revolutionary INTELLI-SCAN Laser System provides “The Third Dimension in Inspection Capability”, the ability to precisely measure the Z-height of any given region of interest. This advanced technology provides:
We are equally pleased to offer the industry’s most advanced desktop AOI system. MIRTEC’s MV-3L is undoubtedly the most widely accepted Five Camera Desktop AOI system on the market. The MV-3L uses the same optics and lighting system as the MV-7L to ensure 100% programming compatibility across the product line. MIRTEC has recently introduced the INTELLI-BEAM Laser System Option for our MV-3L System. This advanced technology was adapted to our Desktop Series at the request of our valued customers.”
“MIRTEC’s success is based on a commitment to bring to the market new and innovative products with a special emphasis on quality, accuracy, ease of operation and reliability”, says D’Amico. “This combined with an extremely talented team of sales and support professionals, has truly fueled the tremendous growth of this organization.”
Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System.
10 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design
Advanced Dual Projection SHADOW FREE MOIRÉ Design
2 Micron Height Accuracy
An extremely compact 2D inline AOI system. The MV-6 is configured with MIRTEC’s exclusive 10 Mega Pixel Top-Down camera with a precision 13.4 µm Telecentric Compound lens and four 10 Mega Pixel Side-View ca...
The MV-7 OMNI 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION® 2D/3D Inspection Technology which combines an exclusive 15MP 2D ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moir&eacut...
High Speed Precision In-Line SPI System Exclusive TWENTY-FIVE MEGA PIXEL ISIS® Vision System 7.7 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design Advanced Dual...
FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive TWENTY-FIVE MEGA PIXEL ISIS® Vision System 7.7 M...
Single Camera Desktop AOI System. FIVE MEGA PIXEL Digital Color Camera Technology. 13.4 Micron / Pixel Resolution. Extremely Simple Programming and Operation. Superior Defect Detection / Lowest F...
MS-11 Series In-Line Solder Paste Inspection (SPI) System uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCB's post screen print. High Speed Precision In-Li...
MIRTEC's MV-3 Series is the world's first generation of five camera Desktop AOI systems. The MV-3 Series offers advanced 5, 10 and 15 Mega Pixel Digital Colour Camera Technology with telecentric lens in a ...
Nov 21, 2012 | Brian D'Amico
The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages....
Apr 24, 2017 | This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Apr 22, 2017 | MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
Apr 03, 2017 | MIRTEC today announced they are participating in the upcoming What's New in Electronics Live! event. They will exhibit in booth #8. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK.
Feb 15, 2017 | MIRTEC, “The Global Leader in Inspection Technology,” announces that it received the prestigious 2017 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center.
Jan 23, 2017 | MIRTEC Co. LTD, “The Global Leader in Inspection Technology”, reports record sales revenue for its North American Sales and Service Division for 2016. “We are very pleased to announce that MIRTEC’s North American Division has achieved record sales growth in 2016!” stated Brian D’Amico, President of MIRTEC Corp.
Jan 11, 2017 | MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.
Dec 27, 2016 | MIRTEC, “The Global Leader in Inspection Technology,” announces that Ankatek of Turkey has been awarded the 2016 Achievement award as the distributor who has really gone above and beyond. In Ankatek’s case, that means breaking into a previously dormant market.
Dec 18, 2016 | MIRTEC, “The Global Leader in Inspection Technology,” today announced that 2016 has been the company’s best year since its opening in 2008.
Dec 18, 2016 | MIRTEC, “The Global Leader in Inspection Technology,” today announced that Accurex Solutions of India has won their 2016 Sales Award, leading in equipment sales for all MIRTEC Europe distributors. For 29 years, Accurex Solutions has been the leading manufacturers’ supplier and service provider in India.
Dec 05, 2016 | MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that EIT, LLC, a High-Tech Electronic Manufacturing Services (EMS) company specializing in high-quality manufacturing and box-build assemblies, has selected MIRTEC’s MV-6 OMNI 3D AOI Machine based on outstanding performance and 3D defect detection capability.