Intel Corporation
Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.
For 35 years, Intel Corporation has developed technology enabling the computer and Internet revolution that has changed the world. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971.
Today, Intel supplies the computing and communications industries with chips, boards, systems, and software building blocks that are the "ingredients" of computers, servers and networking and communications products. These products are used by industry members to create advanced computing and communications systems. Intel's mission is to be the preeminent building block supplier to the Internet economy.
Intel Corporation Postings
32 technical articles »
Package-on-Package (PoP) Warpage Characteristic and Requirement
Dec 16, 2021 | Wei Keat Loh, Ron Kulterman, Tim Purdie, Haley Fu, Masahiro Tsuriya
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging....
Challenges of Manufacturing with Printed Circuit Board Cavities
Jan 06, 2021 | William O. Alger, Pedro J. Martinez, Weston C. Roth
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB...
Dec 12, 2019 | Raiyo Aspandiar
Presented at SMTA Boise Expo and Tech Forum, March 20, 2018...
Preparing for Increased Electrostatic Discharge Device Sensitivity
Oct 08, 2015 | Julian A. Montoya, Intel Corporation Hillsboro, Oregon
With the push for ever improving performance on semiconductor component I/O interfaces, semiconductor components are being driven into a realm which makes them more sensitive to electrostatic discharge, potentially increasing in sensitivity by 50% every 3-5 years. Today, the majority of modern day semiconductor components are being designed to meet 250Volts of charge device model sensitivity, and that could decrease to 125Volts in the next 3-5 years, and could again decrease to 50Volts-70Volts in the following 3-5 years. The entire electronics industry must prepare for this challenge....
Stereo Vision Based Automated Solder Ball Height Detection
Apr 16, 2015 | Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State University, Bonnie L. Bennett, Jeff S. Pettinato;Intel Corporation.
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...)
In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement....
May 16, 2013 | John Davignon, iNEMI Chair
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI initiated a HFR-Free Leadership Workgroup to evaluate the readiness of the Industry to make this transition. The HFR-Free Leadership WG concluded that the electronic industry is ready for the transition and that the key electrical and thermo-mechanical properties of the new HFR-Free laminates can meet the required criteria. The HFR-Free Leadership WG verified that the laminate suppliers can meet the capacity demands for these new HFR-Free laminates and developed a "Test Suite Methodology" (TSM) that can facilitate the comparison and choice of the right laminate to replace brominated FR4 in the Client space... First published in the 2012 IPC APEX EXPO technical conference proceedings....
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Jun 27, 2012 | Chu-tien Chia, Richard Kunze, David Boggs, Margaret Cromley
First published in the 2012 IPC APEX EXPO technical conference proceedings. Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high speed channel performance. Determining and controlling PCB inser...
Implementation of a High-Quality Dolby* Digital Decoder Using MMX™ Technology
May 07, 1999 | James C. Abel, Michael A. Julier
Software decoding of Dolby Digital allows it to become a baseline capability on the PC, with greater flexibility than a hardware approach. Intel's MMX™ technology provides instructions that can significantly speed up the execution of the Dolby Digital decoder, freeing up the processor to perform other tasks such as video decoding and/or audio enhancement. Intel has worked closely with Dolby Laboratories to define an implementation of Dolby Digital based on MMX technology that has achieved Dolby's certification of quality....
MMX™ Microarchitecture of Pentium® Processors With MMX Technology and Pentium® II Microprocessors
May 07, 1999 | Michael Kagan, Simcha Gochman, Doron Orenstien, Derrick Lin
The MMX™ technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386™ microprocessor. The challenge in implementing this technology came from retrofitting the new functionality into existing Pentium® and Pentium® Pro processor designs....
MMX™ Technology Architecture Overview
May 07, 1999 | Millind Mittal, Alex Peleg, Uri Weiser
Media (video, audio, graphics, communication) applications present a unique opportunity for performance boost via use of Single Instruction Multiple Data (SIMD) techniques. While several of the computeintensive parts of media applications benefit from SIMD techniques, a significant portion of the code still is best suited for general purpose instruction set architectures. MMX™ technology extends the Intel Architecture (IA), the industry's leading general purpose processor architecture, to provide the benefits of SIMD for media applications....
5 news releases »
Intel To Shut Down Makati Manufacturing Facility
Mar 13, 2002 | Computer chip giant Intel Corp. is set to consolidate its operations in the Philippines this year which would lead to the closure of its manufacturing facility in Makati.
Intel Expands Optical Networking Business
Mar 08, 2002 | Intel Corp. is expanding its optical networking business to include photonics design and manufacturing, which adds to the company's optoelectronic component and highly integrated optical module capabilities. The announcement is part of Intel's long-term strategy to grow its communications business and be a leading building block supplier for high speed, high capacity optical networks.
Otellini Named President And COO By Intel
Jan 17, 2002 | Intel Corp. today announced that its board of directors has elected 27-year Intel veteran Paul S. Otellini president and chief operating officer.
Intel Ships Prestonia Server Microprocessor
Jan 14, 2002 | Intel Corp. has started shipping sample quantities of its next-generation Prestonia server chip made on its 0.13-micron process, a spokesman confirmed Friday. The server version with 512-kilobyte on-chip cache is the first quad-pumped architecture slated for the server market.
Intel Denies Buying Shares in Agere $3.6 Billion IPO
Mar 29, 2001 | Intel Corp. (INTC) did not buy shares in Wednesday's $3.6 billion initial public offering of Lucent Technologies Inc.'s Agere Systems unit (AGRa), an Intel spokesman said, contradicting a report by cable news network CNBC.
