SEICA SpA

SEICA offers innovative ATE solutions which range from Bare Board Test, Flying Probe Systems, In-Circuit and Combi Test to Functional Test.

Manufacturer of Assembly Equipment, Test Services

Founded in 1986 in Strambino, a small town located in the Canavese district of Italy (long noted for its high concentration of electronic and information technology companies), SEICA has eprogressed from developing its first in-circuit Test  system for the domestic electronics industry to become a world leader in Flying Probe and functional test systems. Today Seica is one of the major suppliers of test equipment, with more than 1000 systems installed on five continents.

Over the years the Company has grown up, and now has subsidiaries in France (2000), the United States (2003), China (2004) and Germany (2008), with a global distribution network covering market needs worldwide.

Research and implementation of new technologies

From the beginning Seica has led in innovation, researching and implementing new technologies. In 1994, SEICA was the first European Company to design and manufacture a Flying Probe tester, and in 2003 presented a revolutionary, laser-based selective soldering solution.

Product development

The research in new technologies is promptly applied in the development of new products, allowing Seica to offer a widely diverse and flexible portfolio of products. The company, in fact, has 5 different product lines:

  • Pilot Line: flying probe test systems
  • Valid Line: high performance functional test systems
  • BBT Line: Bare board test systems
  • Compact Line: In-circuit and functional test systems
  • Firefly Line: Laser selective soldering systems


Solutions and systems integrated in a unique  platform

All SEICA products are based on its unique hardware and software platform, called VIVA Integrated Platform (VIP). The VIVA software offers a complete set of automated instruments to develop, execute and maintain in-circuit and functional test  programs for analog, digital and hybrid boards and the VIP hardware includes integrated, DSP technology, delivering  fast, accurate, comprehensive solutions which are extremely cost effective.

Cooperation

Seica’s R&D Team often cooperates with researchers from univerisites such as the Politecnico of Torino to compare its technologies with the latest in engineering innovation.

SEICA SpA Postings

4 products »

RAPID 270 Bare Board Tester

The RAPID Testers Line is a complete test solution for the printed circuit board world wide market. High Speed High Accuracy User Friendly Graphical User Interface (GUI) Low Maint...

Test Equipment

RAPID 270 Bare Board Tester

COMPACT In-cuircuit Tester

The new COMPACT Line collects the inheritance and success of the historic line of SEICA in-circuit and functional testers, designed meeting the requirements of the so called “lean production”, with a specific attention to the requir...

Test Equipment

COMPACT In-cuircuit Tester

Firefly Laser Selective Soldering System

Firefly is the selective soldering solution that has been developed to satisfy the ever growing need of modern electronics manufacturing for maximum flexibility, and to address the particular problems related to the introduction of the new lead-fr...

Selective Soldering

Firefly Laser Selective Soldering System

Pilot V8 Double-sided Flying Prober

The Pilot V8 represents the latest frontier in flying probe test technology, and is the complete solution for those who want maximum performance: the highest test speed, test coverage and flexibility, whether they are testing p...

Test Equipment

Pilot V8 Double-sided Flying Prober

1 technical article »

FlyScan: Wenn eins plus eins mehr als zwei ist

May 24, 2010 | Bernd Hauptmann – Sales Manager Seica Deutschland GmbH

Die echte Integration zwischen ATE Flying Prober und Boundary Scan Tester, vorgestellt von Seica, kombiniert das Beste von beiden Testtechniken und multipliziert die Vorteile für den Anwender....

64 news releases »

Seica Inc. participation at Semicon West, July 10-12 2018, Booth 509, San Francisco, CA.

Jul 02, 2018 | Presented for the first time in US during IPC Apex, it will also be shown at Semicon West booth 509, Pilot V8 Next> series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.

New Haverhill headquarters celebration

Jul 02, 2018 | On 6 June SEICA inc. has officially inaugurated the new North American headquarters in the Ward Hill Business Park East of Haverhill, Massachusetts.

Press preview for Seica Inc. participation at Semicon West, July 10-12 2018, Booth 509, San Francisco, CA.

Jun 24, 2018 | Presented for the first time in US during IPC Apex, it will also be shown at Semicon West booth 509, Pilot V8 Next> series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.

Press preview for Seica SpA participation at SMT, Nuremberg, June 5-7 – 17 2018, Hall 5, Booth 220, Exhibition center, Nuremberg.

Apr 25, 2018 | Seica announced that at SMT they will be showcasing their new Next> generation of solutions, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. Joining the The Next> series of test systems, first previewed last year at productronica will be Viva 6 Next>, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program.

Seica Technology Days of Anglo Production Process 13 th -14th February 2018, Birmingham

Mar 20, 2018 | Seica attended the Technology Days of Anglo Production Process (APP) on 13th and 14th March, an event organized by the Birmingham Company which operates as a representative and provider of products for Electronic Manufacturing in the United Kingdom.

Press preview for Seica ATE SEMINAR 20th February 2018, Daniel Hotel Herzliya, Israel

Mar 16, 2018 | After the first successful edition, the Seica Seminar took place again in Israel on 20th February 2018. Our local representative Spider Engineering was able to perfectly arrange an amazing event in the beautiful location of the Daniel Hotel in Herzliya with over 130 people attending. The participants, a real technological elite, were representing a large number of defense institutions, government corporation and private companies showing once more the complexity and the extremely high value of Israeli market in the electronics environment.

Seica ATE SEMINAR 20th February 2018, Daniel Hotel Herzliya, Israel

Mar 11, 2018 | After the first successful edition, the Seica Seminar took place again in Israel on 20th February 2018. Our local representative Spider Engineering was able to perfectly arrange an amazing event in the beautiful location of the Daniel Hotel in Herzliya with over 130 people attending. The participants, a real technological elite, were representing a large number of defense institutions, government corporation and private companies showing once more the complexity and the extremely high value of Israeli market in the electronics environment.

Press preview for Seica Inc. participation at Apex, San Diego, California, February 27, 28 – March 1, 2018, Booth 2323, San Diego Convention Center.

Feb 27, 2018 | Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.

Press preview for Seica Inc. participation at Apex, San Diego, California, February 27, 28 – March 1, 2018, Booth 2323, San Diego Convention Cente

Feb 08, 2018 | Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.

Press preview for Seica Inc. participation at Apex, San Diego, California, February 27, 28 – March 1, 2018, Booth 2323, San Diego Convention Center.

Jan 09, 2018 | Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.

54 more news releases from SEICA SpA »

BGA Rework Services

Plasma Prior to Conformal Coating