Teradyne

Teradyne is a leading supplier of Automatic Test Equipment used to test semiconductors, wireless products, data storage and complex electronic systems which serve consumer, communications, industrial and government customers.

Inspection, Test Services

A leading supplier of Automatic Test Equipment

Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment (ATE) used to test semiconductors, wireless products, data storage and complex electronic systems that serve consumer, communications, industrial and government customers. In 2014, Teradyne had revenue of $1.65 billion and currently employs approximately 3,900 people worldwide.

The company's divisions, Semiconductor Test Division, System Test Group, and Wireless Test are organized by the products they develop and deliver.

System Test 

Our system test business serves the next level of electronics production as chips are combined into complex electronic systems. From computing to communications, data storage to defense and aerospace and scores of other applications, Teradyne helps electronics manufacturers ensure the integrity and quality of their products. Major product families in our system test business include TestStation, Spectrum, Hi-Speed Subsystem, Neptune and Saturn.

Semiconductor Test

Our semiconductor test business focuses on logic, RF, analog, power, mixed-signal and memory devices—the building blocks of tablets, smart phones, computers, gaming systems and much more. Teradyne’s semiconductor test line-up includes the J750, FLEX, UltraFLEX, Eagle and Magnum.

Wireless Test

LitePoint, our wireless test business provides solutions for the leading manufacturers of wireless modules and consumer electronics. Serving the rapidly growing demand for wireless communications, LitePoint products are used by chipset and product designers along with their contract manufacturers to verify performance, reduce time-to-market and lower the cost of wireless test. From Bluetooth to WiFi to 4G LTE, we speed new products to market while providing industry-leading cost performance. Our products include IQxel for connectivity test and IQxstream for cellular test. Learn more about our wireless test solutions for the RF lab or manufacturing.

Teradyne Postings

8 products »

TestStation LX

Configurable up to 15,360 Test Points TestStation LX2 is Teradyne's largest pin count in-circuit test system. Configurable up to 15,360 pins, TestStation LX2 utilizes the new UltraPin II 128HD pin card for testing large, comple...

Test Equipment

TestStation LX

TestStation LH

Affordable In-Circuit Test The TestStation LH in-circuit test system is a lower-cost, small footprint, feature scalable version of Teradyne's popular, award winning TestStation product family. TestStation LH features SafeTest p...

Test Equipment

TestStation LH

TestStation Duo

True Parallel Test The TestStation Duo is a true concurrent test system with independent test modules providing fast in-circuit test throughput and lowering high-volume production costs. It effectively doubles the test t...

Test Equipment

TestStation Duo

TestStation Automated Inline Handler

Teradyne's TestStation High-Speed Inline Automated Handler is compatible with TestStation Multi-Site Inline configurations designed for the most productive and lowest cost in-circuit test package. Advantages The Test...

Test Equipment

TestStation Automated Inline Handler

TestStation Multi-Site

Teradyne's TestStation Multi-Site systems deliver 2 to 4 times greater test capacity, delivering 200 to 400% greater productivity, and 40 to 50% lower total cost of test compared to a conventional single site system. Supporting a full range...

Test Equipment

TestStation Multi-Site

Teradyne Design-to-Build (D2B) Software

Software that Optimize PCBA Test and Inspection Efficiencies. The unique capabilities of Teradyne's D2B software enable EMS and OEM manufacturers and partners to interconnect their global enterprises to optimize printed circuit...

Software

Teradyne Design-to-Build (D2B) Software

Spectrum 8862 In-Circuit Test System

Teradyne’s Spectrum™ 8862 (TSSE) is a unique combinational in-circuit (ICT)/ functional test system that can lower overall costs and test times for manufacturers that prefer to combine functional and ICT test capabilities on a singl...

Test Equipment

Spectrum 8862 In-Circuit Test System

TestStation Fastest In-Circuit Test Platform

Reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies. TestStation in-circuit test systems provide full structural and functional coverage for a wide range of manufacturing, co...

Test Equipment

TestStation Fastest In-Circuit Test Platform

5 technical articles »

Comparing Costs and ROI of AOI and AXI

Aug 07, 2013 | Peter Edelstein, Teradyne

PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen......

Principles of Analog In-Circuit Testing

Dec 26, 2012 | Anthony J. Suto, Teradyne

Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices....

Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers

Dec 14, 2012 | Alan J. Albee

The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test....

Designing PCBs for Test and Inspection

Dec 14, 2012 | Michael J. Smith, Teradyne

This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design....

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

May 03, 2012 | Anthony J. Suto

First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec...

29 news releases »

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 | New Real Time Audit (RTA) Tool for the UltraFLEX platform.

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 | New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 | The Oasis Toolset is designed to address the unique test challenges posed by complex semiconductor devices.

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 | Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 | United Test and Assembly Center, Ltd. (UTAC) selected the J750EX-HD and placed a multi-system order.

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 | Ms. Johnson has more than 25 years of financial management experience in technology driven global businesses.

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 | New System Architected to Optimize Digital Bus and Real-time Testing of Circuit Boards, Assemblies and Systems

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 | Expands Solutions for High Speed Avionics Data Bus Testing

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 | Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced

Registration Opens for 2015 Teradyne Users Group Conference

Apr 03, 2015 | Technical Knowledge Exchange Brings Together ATE Industry's Best Minds

19 more news releases from Teradyne »

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