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Teradyne
Teradyne manufactures automatic test equipment that delivers competitive advantage to the world's semiconductor, electronics and network systems companies.
categories: Manufacturer of Components, Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Design
Teradyne (NYSE:TER) is the leading supplier of Automatic Test Equipment (ATE) used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries.
Semiconductor Test
Teradyne is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells in System-On-a-Chip (SOC) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification and internet applications.
Systems Test
Teradyne designs, manufactures and markets a broad range of circuit board test and inspection systems, peripheral instrumentation and related software, and test-development tools for commercial board test. The solutions provide rapid-cycle-time inspection and cost-effective test platforms for prototyping, manufacturing and depot repair stations worldwide.
Teradyne Postings
Teradyne has 2 product(s) in the catalog »
category: Test
The TestStation SE™ is the natural Z18xx replacement system. It builds on the Z1800-Series&...
category: Test
The Spectrum 8855xp can be configured with up to 5120 non-multiplexed in-circuit channels. Spectr...
Teradyne has 4 technical article(s) »
Principles of Analog In-Circuit Testing
Published: |
Dec 26, 2012 |
Author: |
Anthony J. Suto, Teradyne |
Abstract: |
Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices.... |
Backdrive Current-Sensing Techniques Provide ICT Benefits
Published: |
Dec 14, 2012 |
Author: |
Alan Albee, Teradyne |
Abstract: |
This paper discusses the challenges of performing powered-up vector testing of low voltage technologies on traditional in-circuit testers and describes the safeguards that are necessary to ensure that test vectors do not violate the increasingly tight specifications of low voltage parts.... |
Designing PCBs for Test and Inspection
Published: |
Dec 14, 2012 |
Author: |
Michael J. Smith, Teradyne |
Abstract: |
This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design.... |
Teradyne has 16 news release(s) »
Teradyne Users Group Conference Announces 2012 Call for Papers
Aug 30, 2011 | The Teradyne Users Group (TUG) has announced the 2012 Call for Papers for its annual conference at the Hilton Head Marriott in Hilton Head, South Carolina on April 30 through May 2, 2012. The event provides Teradyne customers and engineers with knowledge, tools and techniques to enhance their jobs.
Teradyne Introduces New Instrumentation for the UltraFLEX Test System
Jul 14, 2011 | Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Sino IC Technology Adopts Teradyne UltraFLEX Test System
Jul 14, 2011 | Sino IC Technology selected the Teradyne® UltraFLEX® to test RF, baseband and broadband devices. Sino IC Technology chose the UltraFLEX based on its high parallelism, superior accuracy and broad spectrum of instrumentation.
Teradyne Announces Sale of Automotive System Test Unit
Feb 21, 2011 | Teradyne, Inc. announced today that it has reached an agreement to sell its Automotive Diagnostic Solutions unit to SPX Corporation. Diagnostic Solutions, which serves transportation OEMs, tier-one suppliers and independent service providers is based in Manchester, England and has other major operations in Munich and Detroit. The terms of the sale were not disclosed. Completion of the transaction is expected no later than the second quarter 2011.
Feb 17, 2011 | Teradyne, Inc. announces that Solution Sources Programming (SSP), a global leader in providing state-of-the-art test solutions for the high-tech, medical, military, industrial and consumer electronics industries, has taken delivery of the Teradyne® flagship in-circuit test system, the TestStation LX™.
Registration Opens for 2011 Teradyne Users Group Conference
Feb 07, 2011 | Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
Timothy Guertin Elected to Teradyne’s Board
Jan 26, 2011 | Teradyne announced the election of Timothy Guertin to its Board of Directors on January 24.
Unisem Selects Teradyne ETS-88 for Analog and Power Management Test
Nov 03, 2010 | Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
Teradyne Reports Third Quarter 2010 Results
Oct 30, 2010 | Teradyne, Inc. reported revenue of $502 million for the third quarter of 2010 of which $448 million was in Semiconductor Test and $54 million in Systems Test Group.
Realtek Adopts J750Ex for Complex SOC Test
Oct 08, 2010 | Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.
Contact information
Teradyne
600 Riverpark Drive
North Reading, Massachusetts, 01864
United States
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