SMT Equipment

Xi3400 Automated X-ray Inspection System

Xi3400 Automated X-ray Inspection System

Xi3400 Automated X-ray Inspection System


Xi3400 Automated X-ray Inspection System



Offered by:

Nordson DAGE

Company Information:

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

Inspection, Test Services

  • Phone +44 (0) 1296 317800
  • Fax +44 (0) 1296 317801

Nordson DAGE website

Company Postings:

(11) products in the catalog

(1) technical library article

(116) news releases

Xi3400 Automated X-ray Inspection System Description:

Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up.

The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device manufacturers and related applications.

Nordson DAGE’s versatile Xi3400 Automated X-ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the Xi3400’s innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

By leveraging the automation software techniques developed at Nordson YESTECH and combining with Nordson DAGE hardware technology, including the patented Digitial Tomosynthesis Technology, the Xi3400 acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.

The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate.

  • Automated 2D & 3D inspection
  • Variable magnification
  • High defect detection
  • Low false calls
  • Fast throughput
  • Quick set-up

Inspection Capabilities

  • Modes 2D and 3D operation
  • Maximum Board Size: 508mm x 450mm (20” x 18”)
  • Clearance: up to 50mm (2”) top & 25mm (1”) bottom
  • Minimum Component Size: 01005
  • Defects Detected: Part: position, missing, wrong, skew, tombstone
  • Lead: bent, lifted, bridging
  • Solder: open, insufficient, short, solder balls
  • BGA: shorts, voids, position, missing ball

Xi3400 Automated X-ray Inspection System was added in Dec 2015

Xi3400 Automated X-ray Inspection System has been viewed 577 times

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