StencilQuik™ BGA Rework Stencils
StencilQuik™ BGA Rework Stencils
StencilQuik™ BGA Rework Stencils Description:
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StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method.
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield.
- Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?
- Are you squeezed for space on the PCB in and around the BGA area being reworked?
- Do want to insure that a reliable rework process is used that subjects the BGA to a minimal number of heat excusions?
We have an answer to your frustrations - StencilQuik™.
StencilQuik's breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.CSPs.
StencilQuik™ BGA rework stencils make it easy for you to place BGAs. Whether the site is being reworked, you are simply wanting to place a part on a prototype board or the mask damaged underneath the part needs to be repaired, StencilQuik™ is the method to use for BGA placement. For rework applications the need for a high end split vision rework system is eliminated. The balls tactily can be felt fitting in to the apertures of the stencil. A simple time temperature heat source will now reflow the solder balls on the bottom of the device. This simplicity is carried over to the prototyping area as complex packages such as BGAs and CSPs can be easily placed without the need for or training in high end equipment. Finally, the StencilQuik™ BGA rework stencils have a side benefit of being able to repair solder mask underneath the location as the polyimide is an elegant “band aid” for the repair of the damaged mask.
Whether you are using paste flux or solder paste StencilQuik™ speeds up the area array rework process while providing for a more reliable connection. This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs.Recently, the method has been added as IPC 7711 Procedure 5.7.2. These flexible BGA rework stencils remain in place on the site location becoming an integral part of the PCB assembly.
Device Make Up and Engineering
StencilQuik™ is manufactured from a polyimide film with a high temperature adhesive covered with a release liner. It is the same type of material you have been using with bar code labels and for protecting gold fingers during the wave soldering process. These stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.
StencilQuik™ comes in 4, 6 and 8 mil total thicknesses and are packaged in groups of (10) in a small antistatic poly bag. There are no tooling charges. New or complex patterns are designed from the part datasheet and will be confirmed in many cases with a checkplot. Squeegees are sold separately. They are shipped in 3-5 business days.
Testing Proves it Out
Check out the independent testing that has been done on this product to verify these results.
An independent lab has tested the StencilQuik(TM) product (See panel "B") to make sure that there is no ionic contaminates left behind by any of the adhesive residues.
StencilQuik™ BGA Rework Stencils was added in Jan 2006
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