SIPAD boards delivered with solid solder and adhesive flux protected by release paper

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards are then washed to remove flux residue from initial reflow. Once clean, the boards are transported through the SIPLAN 300 flattening system that reheats and flattens the ssd's perfectly planar with each other. Adhesive flux is applied and protected with release paper until assembly. Components can be placed by hand or machine. Once heated the pads return to the original shape fusing the component leads with excellent repeatable results.

Sample kits are available at www.sipad.com