BGA Spheres

Company Information:

Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

TaoYuan County, Taiwan

Assembly, Component Packaging, Manufacturer of Assembly Material, Repair/Rework, Soldering

  • Phone +886-3-416-0177
  • Fax +886-3-416-0133

Shenmao Technology Inc. website

Company Postings:

(18) products in the catalog

(28) news releases

BGA Spheres Description:

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. BGA Sphere is available for customers' specifications.

Bumpping錫膏

Features:

Diameter Tolerance
0.76mm~0.50mm ±20um
0.45mm~0.10mm ±10um

* Please contact us for other diameter and any requirement.

View BGA Spheres on Shenmao Technology Inc. website

BGA Spheres was added in Feb 2017

BGA Spheres has been viewed 121 times

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