SMT Equipment

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G / SM-155P Single Component Epoxy Adhesive

Name:

SM-150G / SM-155P Single Component Epoxy Adhesive

Category:

Solder Materials

Offered by:

Shenmao Technology Inc.

Company Information:

Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

TaoYuan County, Taiwan

Assembly, Component Packaging, Manufacturer of Assembly Material, Repair/Rework, Soldering

  • Phone +886-3-416-0177
  • Fax +886-3-416-0133

Shenmao Technology Inc. website

Company Postings:

(18) products in the catalog

(43) news releases

SM-150G / SM-155P Single Component Epoxy Adhesive Description:

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process. SM-150G and SM-155P are also provided with well plastic shape, a powerful and stable adhesive strength for a variety of component parts.

Physical Characteristics and Application

NO.

Items

Specification

1

Chemical Type

Epoxy

2

Components

One component

3

Cure Type

Heat cure

4

Application

Surface mount adhesive

5

Suitable Process

SM-150G : Glue dot process
SM-155P : Printing machine process

6

Viscosity
(Brookfield / 5.0rpm / 25℃ )

SM-150G:55,000 ± 10000 cps
SM-155P:35,000 ± 7000 cps

7

Thixotropy index

SM-150G:6.5 ± 1.0
SM-155P:5.0 ± 0.7

Typical Curing Performance

Curing rates depend on the mass of material to be heated and intimate contact with the heat sources. Other curing conditions may also yield satisfied results. Recommended conditions for curing are as follows.

Recommended Curing Condition
Curing Temperature 150℃ 125℃ 100℃
Curing Time 1.5~2.0 min 2.0~3.0 min 9.0~10 min

Performance of Push-off Strength

Push-off Strength Shear Strength (N/mm2) Shear forces (Kgf)
Chip Size (Chip:1206R) ≧15.0 ≧7.0
(Chip:0805R) ≧10.0 ≧2.5
(Chip:0603R) ≧10.0 ≧1.5

Packaging

SM-150G is syringe based packaging, and the capacities are 10mL, 30mL, and 300ml. SM-155P can be provided with syringe and jar packaging. The capacity is 250mL.

SM-150G / SM-155P Single Component Epoxy Adhesive was added in Feb 2017

SM-150G / SM-155P Single Component Epoxy Adhesive has been viewed 6 times

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