SM-150G / SM-155P Single Component Epoxy Adhesive
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SM-150G / SM-155P Single Component Epoxy Adhesive |
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SM-150G / SM-155P Single Component Epoxy Adhesive Description:
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process. SM-150G and SM-155P are also provided with well plastic shape, a powerful and stable adhesive strength for a variety of component parts.
Physical Characteristics and Application
|
NO. |
Items |
Specification |
|
1 |
Chemical Type |
Epoxy |
|
2 |
Components |
One component |
|
3 |
Cure Type |
Heat cure |
|
4 |
Application |
Surface mount adhesive |
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5 |
Suitable Process |
SM-150G : Glue dot process |
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6 |
Viscosity |
SM-150G：55,000 ± 10000 cps |
|
7 |
Thixotropy index |
SM-150G：6.5 ± 1.0 |
Typical Curing Performance
Curing rates depend on the mass of material to be heated and intimate contact with the heat sources. Other curing conditions may also yield satisfied results. Recommended conditions for curing are as follows.
| Recommended Curing Condition | |||
| Curing Temperature | 150℃ | 125℃ | 100℃ |
| Curing Time | 1.5~2.0 min | 2.0~3.0 min | 9.0~10 min |
Performance of Push-off Strength
| Push-off Strength | Shear Strength (N/mm2) | Shear forces (Kgf) | |
| Chip Size | (Chip:1206R) | ≧15.0 | ≧7.0 |
| (Chip:0805R) | ≧10.0 | ≧2.5 | |
| (Chip:0603R) | ≧10.0 | ≧1.5 | |
Packaging
SM-150G is syringe based packaging, and the capacities are 10mL, 30mL, and 300ml. SM-155P can be provided with syringe and jar packaging. The capacity is 250mL.
SM-150G / SM-155P Single Component Epoxy Adhesive was added in Feb 2017
SM-150G / SM-155P Single Component Epoxy Adhesive has been viewed 623 times
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