Surface Mount Technology Industry Directory

Surface Mount Technology companies


Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

Manufacturer of Assembly Material, Assembly, Component Packaging, Repair/Rework, Soldering

Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.

Shenmao Technology Inc. Postings
18 products »
Formosa Lead Free Solder Paste

Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably. ...

Solder Materials

Formosa Lead Free Solder Paste
Formosa Halogen Free Solder Paste

Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....

Solder Materials

Formosa Halogen Free Solder Paste
Formosa Low Temperature Solder Paste

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃ ...

Solder Materials

Formosa Low Temperature Solder Paste
Formosa Package on Package Solder Paste

For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others. Package on Package (PoP)...</p>
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Formosa Package on Package Solder Paste
Formosa Water Soluble Solder Paste

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...

Solder Materials

Formosa Water Soluble Solder Paste
Formosa Bumping Solder Paste

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can...

Solder Materials

Formosa Bumping Solder Paste
Formosa Tin Lead Solder Paste

Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...

Solder Materials

Formosa Tin Lead Solder Paste
Water Soluble and No-Clean Fluxes

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...

Solder Materials

Water Soluble and No-Clean Fluxes
SM-150G/SM-155P Epoxy Adhesives

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G/SM-155P Epoxy Adhesives
SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G / SM-155P Single Component Epoxy Adhesive
BGA Spheres

BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy. Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are ...

Solder Materials

BGA Spheres
Solder Preform

Solder Preforms offers accurate solder deposition for various soldering processes. Reel packaging provides opportunity of automation for efficient application. Custom Material may be formulated to unique material and dimensional requirements. ...

Solder Materials

Solder Preform
Solder Ribbon

High Quality Solder Ribbon manufactured by SHENMAO is available in many standard Alloys and Sizes. It has the lowest flow temperature, best wetting and best flow characteristics. Formulated to your unique Alloy and dimensional requirements. ...

Solder Materials

Solder Ribbon
PV Ribbon

During our more than 30 years serving in solder materials with solid R&D and total solution capabilities, Solarjoin delivers the best quality of PV Ribbon and Flux to meet your high reliability requirements. ...

Solder Materials

PV Ribbon
Halogen Free Solder Wire

We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available.   Alloy / FLUX F4 F10 ...

Solder Materials

Halogen Free Solder Wire
Lead Free Solder Wire

Lead Free Solder Wire can be made according to customers' need.   Alloy / FLUX R F5 F7

Solder Materials

Lead Free Solder Wire
Cored Solder Wire

Cored Solder Wire is specially designed with low residue, chlorine content less than 0.1%, flux content 2.0%+0.5 for Hand/Automatic soldering applications assembly. Soldering Wire is available in many alloy composition, Sn60 and Sn63 are...

Solder Materials

Cored Solder Wire
Solder Bar

Solder Bar is made solely from high purity metal, produces a low proportion of dross and its suitable for dip and wave soldering. The quality meets JIS-Z-3282. Solder Bar is available specification in A grade, S grade, Anti-oxide bar, Silver added ba...

Solder Materials

Solder Bar
29 news releases »
SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

May 03, 2017 | SHENMAO is featuring how to solve Solder Paste issues such as Voids, Head on Pillow, Slumping, Non-Wetting Open and Short Stencil Life with Higher Quality Flux and Extremely Pure Virgin Powder made by SHENMAO, Resulting in Solder Joints of Ultimate Quality.

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Mar 20, 2017 | Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico. Three Omega Aleaciones Sales, Service and Application Engineering Staff successfully completed Product Application Training at SHENMAO Technology, Inc. Headquarter in Taiwan.

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Feb 01, 2017 | SHENMAO America supports the SMTA by sponsoring the Luau & Reception at the Pan Pacific Microelectronics Symposium event held at the Sheraton Poipu Kauai Resort in Kauai, Hawaii.

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Jan 30, 2017 | Featuring how to solve Solder Paste issues such as Voids, Head on Pillow, Slumping, Non-Wetting Open and Short Stencil Life with Higher Quality Flux and Extremely Pure Virgin Powder made by SHENMAO, Resulting in Solder Joints of Ultimate Quality.

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 | Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Oct 09, 2016 | SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 26, 2016 | SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader of superior solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Sep 13, 2016 | SHENMAO Technology, Inc. introduces Room Temperature Storable RT Series Solder Paste at the show.

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Aug 23, 2016 | SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 11, 2016 | SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

19 more news releases from Shenmao Technology Inc. »

Contact information

Shenmao Technology Inc.

NO.12-1 Gongye 2nd.Rd., GuanYin Industrial Area
TaoYuan County, 328
Taiwan

  • Phone +886-3-416-0177
  • Fax +886-3-416-0133

Visit Shenmao Technology Inc. website

USA

SHENMAO America, Inc.

2156 Ringwood Ave
San Jose, California, 95131, USA

  • Phone (408) 943-1755
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