SMT Equipment

860 Pressure Curing Oven (PCO)

Company Information:

Heller Industries Inc.

Manufacturer of reflow soldering ovens for automated SMT PCB assembly, specializing in: lead free processing and nitrogen reflow = the best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer of Assembly Equipment, OEM, Soldering

  • Phone 973-377-6800
  • Fax 973-377-3862

Heller Industries Inc. website

Company Postings:

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860 Pressure Curing Oven (PCO) Description:

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

  • PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
  • Heaters, heat exchangers and blowers are internal to the pressure vessel.
  • When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools.

Process Specification:

  • Process time: Generally 120 min or User's spec
  • Operating temp: 60oC ~ 200oC
  • Maximum temp: 220oC
  • Operating pressure: 1 bar - 10 bar
  • Capacity: 24 Magazines (typical)
  • Cooling method: PCW (17oC - 23oC)
  • Cooling water pressure: 25 - 40 psi

Pressure Cure Applications:

  • Composite Forming for the printing industry
  • Die Attach Curing
  • Wafer Laminating
  • Thermal Compress Bonding
  • Underfill Curing
  • Via Filling
  • Film & Tape Bonding

View 860 Pressure Curing Oven (PCO) on Heller Industries Inc. website

860 Pressure Curing Oven (PCO) was added in Aug 2015

860 Pressure Curing Oven (PCO) has been viewed 1136 times

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