EMS TECHNOLOGY, INC.

CONTRACT MANUFACTURING AND ELECTRONICS SERVICES

EMS TECHNOLOGY, INC. Postings

2 news releases »

Engineered Material Systems Debuts New 535-10M UV Cure Adhesive for Disk Drive Applications

Apr 03, 2012 | Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its 535-10M UV Cured Epoxy formulated for disk drive, camera module, optoelectronics and circuit assembly applications.

New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Mar 30, 2012 | Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

One stop service for all SMT and PCB needs