Vi TECHNOLOGY offers a range of products built around two main product categories that have in common Innovative Technology, Reliability and Flexibility.
Vi TECHNOLOGY has developed a wide range of in-line AOI systems that can be placed at any location throughout the line. Powered with Vectoral Imaging, these systems are the most accurate in the market and can inspect up to 400,000 components per hour.
Over the last few years, Vi TECHNOLOGY has developed advanced application software solutions in order to help its customers improve the productivity of their facilities and the quality of their products.
Vi TECHNOLOGY Postings
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in ...
The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridge...
The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology
Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors ...
Heavy Board Solution The 9K Heavy Board AOI is an inspection and process control solution dedicated to heavy PCBAs up to 15 kg and 21” x 24”. The 9K HB AOI has been designed with best-in-class har...
Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Jul 15, 2009 | Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France.
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005....
May 30, 2007 | Jean-Jack Boumendil, Pascal Preti.
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints....
Jul 18, 2017 | Vi TECHNOLOGY will exhibit at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The company will exhibit with three of its manufacturers’ representatives – WKK (Stand 1J65), AmericanTec (Stand 1G65) and First Tech (Stand 1H65). Vi TECHNOLOGY will display its 5K3D AOI and 8K 3D AOI systems coupled with the PI Series 3D SPI.
Jul 09, 2017 | Vi TECHNOLOGY today announced two new partnerships. The company has appointed Hinkofer as its manufacturers’ representative in Germany and G-Force Reps Ltd. as its representative in the South Central USA.
Jun 07, 2017 | Vi TECHNOLOGY today announced plans to participate in the InnovationsFORUM – Mexico, scheduled to take place June 14, 2017 at the Universidad Panamericana in Guadalajara. VP of Global Sales for Vi TECHNOLOGY Jean-Marc Peallat will present “Inspection, big data and zero defect line” during the event.
May 17, 2017 | Vi TECHNOLOGY is pleased to announce that Green Circuits Inc. (www.greencircuits.net) has continued its technical advancements with the selection of the entire Vi TECHNOLOGY suite of AOI, SPI, and Process Management solutions. Green Circuits is a leader in full service contract manufacturing in the heart of Silicon Valley.
Apr 23, 2017 | Vi TECHNOLOGY will exhibit in Hall 4A, Stand 240 at SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany. Vi TECHNOLOGY will show its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Apr 11, 2017 | Vi TECHNOLOGY will exhibit at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will exhibit with three of its manufacturers’ representatives – WKK (Stand 1F50), AmericanTec (Stand 1H48) and First Tech (Stand 1G50). Vi TECHNOLOGY will display its 5K3D AOI coupled with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Mar 15, 2017 | Vi TECHNOLOGY is pleased to announce its expanded relationship with MaCon Máquinas y Consumibles. MaCon has been successful with the sales of Vi TECHNOLOGY’s AOI systems in Argentina, and is adding the award-winning PI Series to its line card. MaCon is becoming the sole distributor of the complete 3D Solutions in Argentina, including 3D SPI, 3D AOI and Sigma Link.
Mar 01, 2017 | Vi TECHNOLOGY is pleased to announce that it participated in AMTEST’s recent open days at the AMTEST facility in Budapest, Hungary.
Feb 23, 2017 | Vi TECHNOLOGY will exhibit in Booth D22 at ENOVA STRASBOURG, scheduled to take place March 15-16, 2017 at the Parc des Exposition in France. Vi TECHNOLOGY will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Jan 29, 2017 | Vi TECHNOLOGY will participate in the Innovations Forum 2017 – Leaders Conference, scheduled to take place March 9, 2017 in Boeblingen, Germany. Vi TECHNOLOGY company representatives will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.