Surface Mount Technology companies
Vi TECHNOLOGY is a worldwide global supplier of a wide range of innovative Automated Inspection AOI, 3D-SPI equipment and software solutions that provide real time data collection and correlation across the SMT line.
Vi TECHNOLOGY offers a range of products built around two main product categories that have in common Innovative Technology, Reliability and Flexibility.
Vi TECHNOLOGY has developed a wide range of in-line AOI systems that can be placed at any location throughout the line. Powered with Vectoral Imaging, these systems are the most accurate in the market and can inspect up to 400,000 components per hour.
Over the last few years, Vi TECHNOLOGY has developed advanced application software solutions in order to help its customers improve the productivity of their facilities and the quality of their products.
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in ...
The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridge...
The large board solution The 5K Series offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY® innovations, including Selective 3D AOI technology
Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors ...
Heavy Board Solution The 9K Heavy Board AOI is an inspection and process control solution dedicated to heavy PCBAs up to 15 kg and 21” x 24”. The 9K HB AOI has been designed with best-in-class har...
Feb 23, 2012 | Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun
Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become an essential part of our SMT environment. Today, most process engineers are turning to machines as an inspection strategy for addressing quality and pro...
Jul 15, 2009 | Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France.
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005....
May 30, 2007 | Jean-Jack Boumendil, Pascal Preti.
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints....
Feb 23, 2017 | Vi TECHNOLOGY will exhibit in Booth D22 at ENOVA STRASBOURG, scheduled to take place March 15-16, 2017 at the Parc des Exposition in France. Vi TECHNOLOGY will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Jan 29, 2017 | Vi TECHNOLOGY will participate in the Innovations Forum 2017 – Leaders Conference, scheduled to take place March 9, 2017 in Boeblingen, Germany. Vi TECHNOLOGY company representatives will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.
Jan 11, 2017 | Vi TECHNOLOGY will exhibit in Booth #501 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Vi TECHNOLOGY will show the 5K3D (3D AOI) and the 2K SPECTRO, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.
Dec 06, 2016 | Vi TECHNOLOGY is pleased to announce the appointment of Miguel Arroyo as its newest Sales – Applications Engineer. Based in the U.S., Arroyo is a professional engineer with diversified experience in advance electronic manufacturing, with extensive background in electronics manufacturing processes.
Oct 02, 2016 | Vi TECHNOLOGY announces that it was awarded a 2016 Global Technology Award in the category of Best Product – Europe for its K Series3D AOI system. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. K Series3D also is available as a cost-effective 3D AOI upgrade to existing 5K, 7K and 9K systems.
Sep 26, 2016 | Vi TECHNOLOGY will exhibit with Fenwick Iberica in Booth 5D12 at MATELEC, schedule to take place October 25-28, 2016 in Madrid, Spain. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI. The PI Series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems.
Aug 31, 2016 | Vi TECHNOLOGY will exhibit in Booth #1019 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.
Aug 29, 2016 | Vi TECHNOLOGY will exhibit in Booth E110 at ENOVA Paris, scheduled to take place Sept. 14-15, 2016 at the Paris Expo Porte de Versailles. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI. PI is the only inspection system to program automatically.
Aug 22, 2016 | Vi TECHNOLOGY will exhibit with AXIS AUTOMATION in Hall 3 – Booth 3141 at ELECTRONICA India, scheduled to take place September 21-23, 2016 at the BIEC- Bangalore International Exhibition Center. Vi TECHNOLOGY will showcase its award-winning PI series 3D SPI. The PI Series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems.
Aug 01, 2016 | Vi TECHNOLOGY will exhibit with SMT Solutions in Booth A-1737 at E-16, scheduled to take place Sept. 6-8, 2016 at the Odense Congress Center in Denmark. Vi TECHNOLOGY will showcase its PI series 3D SPI and 7K DL Series.