Surface Mount Technology companies
Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.
Assembléon is a global supplier of Surface Mount Technology (SMT) Pick & Place solutions for the electronics manufacturing industry. Assembléon is a trustworthy partner, providing full application support, training and services. We offer a product that can be easily integrated into your manufacturing environment, ensuring your equipment runs competitively at all times. Our customers include some of the leading players in industries such as consumer, personal computer and automotive electronics, as well as more specialized fields like module manufacturing and semiconductor backend.
All levels of electronics manufacturing, from prototyping to high volume
To meet today’s electronics manufacturing challenges, Assembléon’s product series focus on performance and flexibility. With the X-Series, A-Series and M-Series pick and place machines, we cover every level of electronics manufacturing, from prototyping to very high volume. But our promise of flexibility doesn’t end with the modular Pick & Place systems. We are committed to working with you to jointly defining the best solution, whether that is a single machine, a complete line or an entire manufacturing plant. By combining state-of-the-art systems with tailored, performance-enhancing services, Assembléon provides you with advanced solutions that help your business stay ahead.
Mar 01, 2012 | Eric Klaver, Senior Product Manager
The struggle to survive in the world of manufacturing is prompting many volume-driven manufacturing sites in the west to specialize in small batch manufacturing. The aim is to bring value to their customers with fast-turnaround prototyping and reduced int...
Oct 13, 2011 | Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market.
Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders....
Jul 21, 2011 | Eric Klaver, Senior Product Manager
In high-volume production, it is the price of the end product that matters. Purchasing decisions for production equipment therefore usually boil down to price divided by output modified by some efficiency factor....
May 19, 2011 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....
Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...
Jul 29, 2010 | Satoshi Kataoka, Eric Klaver
The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult to see, let alone place reliably with high accuracy. Designers were reluctant to...
Nov 24, 2009 | George Babka; Assembléon, David Sbiroli, Chris Anglin; Indium Corporation, Richard Brooks, Christopher Associates
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift in the technology? At what point is solder paste no longer viable? How small of a feature can be printed with solder paste, and can this process be implemented into a production environment?...
Sep 02, 2009 | Accuracy Competence Management, Assembléon BV.
The current trend of miniaturization in products and substrates is expected to continue in most advanced electronic products. Telecommunication and computer applications typically need high density connection boards incorporating smaller passive components, finer pitch IC’s and area array packages. The key factor in the technically successful evolution is the development of new interconnection processes, such as the use of conductive adhesive with very fine grained inter-connection materials....
Aug 12, 2009 | Sjef van Gastel
Energy labels are a key part of global attempts to reduce consumption of environmental resources. They inform customers of the future consequence of their purchases. There are now many national and other energy labels covering houses, cars, lamps, washing machines and dryers, air conditioners, etc. The EU Energy using Products (EuP) directive also is working on classifying industrial applications to set rules for future energy reductions. These rules are at least three years away; until then, there are no energy labels for industrial manufacturing equipment....
Jun 25, 2009 | George Babka, Scott Zerkle; Assembléon Americas, Frank Andres, Rahul Raut, Westin Bent; Cookson Electronics Assembly Materials, Dave Connell; Research in Motion.
Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it "on-the-fly", in software. The recently released Assembléon/Yamaha YGP printer has changed this, and has made new application research possible to study a crucial 01005 process variable for feature printing that previous researchers have ignored.
We have designed the first robust solder paste printing process for 01005 components that uses only a single printer and stencil. We have studied transfer efficiencies across all the major parameters, with important results for reliable high-density equipment assembly. Our findings show that a variable blade contact angle can print fine features with wider process window, and reduce overall process variation between boards produced from a line....
Aug 13, 2012 | Assembléon’s booth at NEPCON South China (Shenzhen, booth 1G50, August 28 – 30) will be dedicated to the perfect combination of quality and flexibility, showing the iFlex and AX-501 Hybrid.
Apr 27, 2012 | Exactly one year after the privatization from Royal Philips, the management of Assembléon is transferred to a new CEO and management team, fully composed of people with a long experience with Assembléon, its customers and technology.Assembleon Welcomes New CEO
Mar 21, 2012 | The IPC APEX 2012 trade show in San Diego was an outstanding success for Assembléon. Assembléon’s latest innovation in pick & place equipment, iFlex, had it's official North America introduction and was well received. iFlex is unique in combining quality, flexibility, efficiency and cost control in one single machine, thus fulfilling the wishes and needs of today’s industry.
Mar 15, 2012 | The IPC APEX 2012 trade show in San Diego was an outstanding success for Assembléon. Assembléon’s latest innovation in pick & place equipment, iFlex, had it's official North America introduction and was well received
Jan 22, 2012 | Assembléon is debuting iFlex at this year’s IPC APEX Expo after its successful first showings in Europe. iFlex is a new innovative, intelligent and flexible SMT solution for electronics manufacturers. It is especially designed to increase productivity in high product mix environments by more than 30%. iFlex produces the highest board quality since it uses Assembléon’s unique single-pick/single-place technology, giving the industry’s highest First Pass Yield production levels with defect levels of less than 10 DPM.
Nov 27, 2011 | ICCO EMT is reporting good first experience with Assembléon’s new iFlex pick & place solution.
Nov 27, 2011 | Assembléon introduced an expanded program of training sessions, support tools and services to guarantee worry-free PCB assembly throughout the lifetime of its pick & place machines.
Nov 27, 2011 | Assembléon has launched iFlex SMT Pick & Place Platform at this year’s Productronica in Munich. iFlex is a complete new intelligent and flexible SMT solution for electronics manufacturers. It is especially designed to increase their productivity in high product mix environments by more than 30%.
Nov 27, 2011 | Assembléon is showing its new A-Series Hybrid pick & place machine for the first time in Europe at Productronica. The A-Series Hybrid introduces Assembléon’s proven parallel placement technique to applications like embedding components into substrates, flip-chip bonding and stacking for module (SiP/MCM) manufacturing.
Aug 24, 2011 | At this year’s Semicon Taiwan, September 7 to 9, Assembléon will make its official appearance in the semiconductor industry with a dedicated solution. In cooperation with local representative Sigmatek, the pick & place solution provider launches the A-Series Hybrid, a new solution within its A-Series lineup targeting manufacturers in the semiconductor back end industry.
De Run 1110
LA VELDHOVEN, 5503
Regional Center the Americas
Assembléon America, Inc.
1225 Old Alpharetta Road #260
Alpharetta, Georgia, 30005, United States
Regional Center Asia Pacific
Assembléon Asia Limited
Suites 507 - 11, 5th. Floor
Tower 1, The Gateway
Harbour City, Kowloon, Alabama, , Hong Kong