TopLine Dummy Components

TopLine has the widest selection of dummy packages and practice boards. In stock BGA, CSP, QFP, TQFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Manufacturer of Components

TopLine stocks daisy chain semiconductor packages, dummy components, zero ohm jumpers, test die, practice kits, IC trays and open cavity packages.

TopLine makes a huge selection of engineering daisy chain test chips for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. Our products help engineers to learn by performing experiments in the lab. We are one-stop for all dummy components.

TopLine Dummy Components Postings

4 products »

Dummy BGA Components

BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling. ...

Components

Dummy BGA Components

Dummy QFP Components

QFP and TQFP Dummy Components with daisy chain for solder practice and temperature profiling. ...

Components

Dummy QFP Components

Dummy MLF Components

MLF leadless CSP with daisy chain for solder practice and temperature profiling. ...

Components

Dummy MLF Components

Test Vehicle PC Boards

100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available. ...

Components

Test Vehicle PC Boards

4 technical articles »

Quick Study Guide to Dummy Components

Nov 13, 2000 | TopLine Dummy Components

Free 16 page reference guide includes lots of pictures. Quickly explains the most important features of SMD components....

Dummy Components Part Numbering System

Nov 13, 2000 | TopLine Dummy Components

Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips....

Quick Guide to Daisy Chain

Nov 13, 2000 | TopLine

Free 16 page booklet shows 200 standard SMD Daisy Chain configurations including BGA, QFP, TQFP, TSOP, SOIC, SSOP, Flat Pack, CERQUAD and more....

SMD Nomenclature - in Plain English

Nov 13, 2000 | TopLine Dummy Components

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included....

1 news release »

TopLine Sponsors IMAPS Wire Bonding Conference

Mar 13, 2018 | TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

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