SMT Products and Services offered by PACE Worldwide
PACE IR 3000 Infrared BGA/SMT Rework System
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Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC
The IR 3000 is the most advanced BGA rework system available on the market today. It can easily
install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared
(IR) top heater and a 1000W IR bottom preheater, the IR 3000 does not require heat-focusing nozzles,
saving you thousands in additional costs. Instead, it uses a unique aperture system to control and
precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR
thermal sensor, the process is completely closed loop temperature controlled using non-contact
measuring methods. Sodr-Cam Reflow Process Observation Camera allows you to watch the entire
reflow process happen in real time.
The IR 3000's fully integrated software and step-by-step instructions makes profiling incredibly simple for
even the most advanced BGA and CSP applications. The software is unique in that it uses PACE-exclusive,
custom developed, PID controllers to control user determined ramp rates by selecting the time and the end
temperature for each phase and provides intuitive set-up, multi-stage profiling, On-the-Fly profile adjustment,
flux-dipping, and much more.
The bottom preheater features an incredibly efficient, high power, quick response quartz IR emitter that is
adjustable when more power is required for high thermal mass applications. The preheater can be adjusted
from its standard position up to 38mm (1.5") closer to the PCB for those applications where additional heat
is desired or needed! This is a unique PACE feature designed especially for use with Lead-Free processes
and your highest-mass, heat-sinking PCB's!
PACE IR 3000 Infrared BGA/SMT Rework System was added in Mar 2017
PACE IR 3000 Infrared BGA/SMT Rework System has been viewed 78 times