SMT Equipment

TF 2700 BGA Rework System

Company Information:

PACE Worldwide

A recognized developer of solutions for the assembly & repair of highly advanced electronics. PACE provides products/training for the soldering, rework & repair of pcb's, specializing in BGA rework, desoldering & fume extraction.

Vass, North Carolina, USA

IPC Standards Certification Center, Manufacturer of Assembly Equipment, Repair/Rework, Soldering, Training Provider

  • Phone 910-695-7223
  • Fax 301-490-0193

PACE Worldwide website

Company Postings:

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TF 2700 BGA Rework System Description:

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Live Demonstration of TF 2700 BGA Rework System

PACE's ThermoFlo Systems (TF 1700 & TF 2700) are the next generation in automated, cost effective solutions for area array package rework. No other systems on the market have the advanced features found on these systems or is easier to use, ensuring operator acceptance and success! Designed for today"s PCBs, ThermoFlo Rework Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, and other SMDs. The PC based software is so advanced that creating profiles has never been easier! The PC software guides the operator through an intuitive interface that virtually automates the process.

All operations: component pick-up, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The PCB holders features fine micrometer adjustment for the most delicate X and Y axis alignments. Precise and accurate, within 25 "m (.001"), Z axis movement is ensured through a twin rail, linear bearing motion control assembly that is similar to those used on automated pick and place equipment. The optic systems utilize advanced digital, color cameras and the highest quality prism available for amazing image clarity. ThermoFlo systems combine convective top-side heating with remarkably stable and powerful IR bottom-side heating for the most effective, repeatable heating process available today. Both systems are self-contained and do not require an external air supply or vacuum connections.

TF 2700 Specifications:

  • Peak Power: 2600W
  • Top Heater Temp. Range: 212° - 750°F
  • Top Heater Air Flow: 0 - 20 slpm
  • Bottom Heater Temp. Range: 212° - 430°F
  • Maximum PCB Size: 24" x 24"
  • Maximum Component Size: 2.5" x 2.5"

View TF 2700 BGA Rework System on PACE Worldwide website

TF 2700 BGA Rework System was added in Jan 2001

TF 2700 BGA Rework System has been viewed 8 times

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