KSW Microtec
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
This company is no longer in business.
Interconnection Technologies, Advanced Packaging, Adhesive Flip-Chip Assembly, Interconnection Technology Development, Technology Transfer and Training, Assembly Services, Smart Card Packaging, Smart Label Packaging, High Volume Production, Wafer Bumping & Plating Service (NiAu, Pd...), Fine-Pitch-Track Printing, Chip-on-Board / Chip-on-Flex, Sensor Packaging, Transponder-Identification Systems, Low Cost Applications, Underfilling, Reliability Tests
Please contact us to discuss you specific requirements. We will find a solution for you!
KSW Microtec Postings
3 products »
Adhesive Flip Chip Technologies
Technology Development...
Technology Development and Bumping...
Prototyping to High Volume Assembly...
