KSW Microtec

Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)

Service Provider

Interconnection Technologies, Advanced Packaging, Adhesive Flip-Chip Assembly, Interconnection Technology Development, Technology Transfer and Training, Assembly Services, Smart Card Packaging, Smart Label Packaging, High Volume Production, Wafer Bumping & Plating Service (NiAu, Pd...), Fine-Pitch-Track Printing, Chip-on-Board / Chip-on-Flex, Sensor Packaging, Transponder-Identification Systems, Low Cost Applications, Underfilling, Reliability Tests

Please contact us to discuss you specific requirements. We will find a solution for you!

KSW Microtec Postings
3 products »
Adhesive Flip Chip Technologies

Technology Development...

Bumping Services

Technology Development and Bumping...

Assembly Services

Prototyping to High Volume Assembly...

Contact information

KSW Microtec

Gostritzer Strasse 63
Dresden, 01217

  • Phone +49-351-8718040
  • Fax +49-351-8718411

Visit KSW Microtec website

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