SMT Equipment

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

Name:

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

Category:

Depaneling

Offered by:

FKN Systek

View S300 - Multiple Blade PLC Controlled PCB Depaneling Saw on FKN Systek website

Company Information:

FKN Systek

Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.

Millis, Massachusetts, USA

Antistatic, Drilling/Routing, Manufacturer of Assembly Equipment, OEM

  • Phone 508 376 2500
  • Fax 508 376 2505

FKN Systek website

Company Postings:

(28) products in the catalog

(5) news releases

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw Description:

Cut panels without scoreline and with overhanging components.

The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs.

  • Singulate panels up to 12" wide.
  • Microprocessor controlled
  • STI safety interlock
  • Long Lasting Diamond Cutting Blade
  • Built in Dust extraction.
  • Cut up to 24 lines in one pass.

The S300 is a diamond blade depaneling saw for use in singulating assembled PCBs. Up to 24 saw blades can be mounted on a spindle. The blades, motor and carriage are covered by an esd safe lid which prevents operator access to the cutting action while it is taking place.

Saw operation is PLC controlled, and a built in dust extraction system with a dust removal extension provides for clean separation and after process clean up of multiple panels at a time. The STI interlock switch for operator safety shuts the system down when the lid is opened. An LCD panel built into the front indicates operating status of the system and can be used to activate the cutting process or program the vacuum system timeout.

The inside of the cabinet is lined with a sound proof AST-64 fireproof batting which helps keep the operating noise level under 75 DB.

Printed circuit boards are placed onto a front guide rail and brought to an adjustable position stop for cutting. An adjustable front blade guard assures that the PCB is held at the correct height to cut just deep enough for clean board singulation.

The diamond saw blade is a 2.95" diameter, .021" thick cutting blade and leaves a smooth edge with minimal stress to the PCB. Since the cutting depth can be adjusted there is no component damage. The blades are covered by a plexiglass enclosures and prevents operator access while cutting. Dust extraction is underneath the path of the cutting blade and provides for a dust free environment. Built to provide a stress free method to singulate panels with sensitive surface mount components close to the edge the S300 is an automatic microprocessor controlled multiple blade model for which up to 8 lines per board can be cut.

Specifications:

  • Weight : 250 Lbs
  • Dimensions : 37” wide x 40” high x 29” Deep
  • Power : 120V AC

View S300 - Multiple Blade PLC Controlled PCB Depaneling Saw on FKN Systek website

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw was added in Jan 2001

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw has been viewed 36 times

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