SMT Equipment

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

Name:

UV Curable Glob Top and Dam-and-Fill Encapsulants

Category:

Materials

Offered by:

Zymet, Inc

Company Information:

Zymet, Inc

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.

E. Hanover, New Jersey, USA

Adhesives/Dispensing, Manufacturer of Assembly Material, Repair/Rework

  • Phone (973)428-5245
  • Fax (973)428-5244

Zymet, Inc website

Company Postings:

(8) products in the catalog

(7) news releases

UV Curable Glob Top and Dam-and-Fill Encapsulants Description:

For encapsulation of wirebonded IC’s

Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline, at low temperatures, permitting the use of low cost substrates that cannot tolerate exposure to high temperatures. Applications include RFD and smartcard assembly, and coating of LCD driver IC's.

The encapsulants offer the following features:

  • Fast curing, in 10-30 seconds
  • Low temperature curing, 80ºC or below
  • Tg as high as 145ºC
  • CTE as low as 18ppm/ºC
  • Excellent adhesion to organic substrates, including polyimide
  • Low ionic contamination
  • Long room temperature stability

UV Curable Glob Top and Dam-and-Fill Encapsulants was added in Oct 2013

UV Curable Glob Top and Dam-and-Fill Encapsulants has been viewed 15 times

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