SMT Equipment

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

Name:

Non-Conductive Pastes (NCP)

Category:

Materials

Offered by:

Zymet, Inc

Company Information:

Zymet, Inc

Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.

E. Hanover, New Jersey, USA

Adhesives/Dispensing, Manufacturer of Assembly Material, Repair/Rework

  • Phone (973)428-5245
  • Fax (973)428-5244

Zymet, Inc website

Company Postings:

(8) products in the catalog

(7) news releases

Non-Conductive Pastes (NCP) Description:

For flip chip attachment of RFID and smartcard IC’s

Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applications. To facilitate high-speed assembly, these adhesives can be cured at moderate temperature is as little as 5 seconds.

Features of Zymet's NCP’s include:

  • Curing in as little as 5 seconds
  • Moderate temperature cure
  • Excellent adhesion to organic substrates, including polyimide and PET
  • Excellent performance in bending tests
  • Excellent resistance to 85ºC/85% RH
  • Syringe dispensable or stencilable
  • Long pot life

Non-Conductive Pastes (NCP) was added in Oct 2013

Non-Conductive Pastes (NCP) has been viewed 3 times

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