CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning

CYBERSOLV® C8882 - Understencil Wipe / Stencil Cleaning Description:

CYBERSOLV® C8882 is a solvent-based stencil cleaning fluid specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees. CYBERSOLV® C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence. CYBERSOLV® C8882 has a flash point over 60°C and evaporates cleanly from the stencil.

CYBERSOLV® C8882 is effective for use within the following stencil cleaning processes:

• Understencil Wipe Cleaning ~ Solvates the flux resin compositions within uncured solder pastes. Effectively cleans and removes solder paste that has a tendency to stick to the aperture walls and bottom of the stencil. Following the wipe process, a dry wipe and vacuum process rapidly dry the stencil following the cleaning process.
• Hand-wipe, Immersion Stencil and Pallet Cleaning ~ The selection of solvents used in CYBERSOLV® C8882 effectively remove polar and non-polar soils. CYBERSOLV® C8882 can be used to hand-wipe a stencil following the printing process.
• Semi-Manual Ultrasonic Stencil Cleaning Systems ~ CYBERSOLV® C8882 is an effective cleaning agent for use with the GEN3 and SAWA ultrasonic absorption mat stencil cleaning systems.
• Solvent Stencil Cleaning Spray Systems ~ CYBERSOLV® C8882 is designed to run in solvent spray-under- immersion and spray-in-air cleaning machines that were commonly designed to clean with IPA. CYBERSOLV® C8882 effectively washes and rinses the stencil.

For optimal stencil cleaning performance, CYBERSOLV® C8882 should be processed “as is” at 100% concentration at ambient temperatures. CYBERSOLV® C8882 wets and rapidly dissolves the flux that holds the solder spheres into a paste. Upon dissolution of the flux, solder balls release from the apertures and drop to the bottom of the cleaning tank. In well-designed stencil cleaning equipment, the solder balls are caught in recirculation filters, greatly extending bath life.

CYBERSOLV® C8882 has no ozone depleting or global warming potential and is non-hazardous. Furthermore, this product does not contain substances prohibited by EU Directive 2011/65/EU, Restriction of Hazardous Substance Directive (RoHS).  Please reference the CYBERSOLV® C8882 Safety Data Sheet for other safety and/or performance considerations.

Free Cleaning Trials and Process Optimizations:

Kyzen will conduct free trials at your factory or one of our global Applications Laboratories in North America, Asia or Europe. Our engineers and lab technicians have developed, optimized and evaluated thousands of customer cleaning processes over the last twenty years. Kyzen’s Applications Labs are unrivaled in the industry and staffed with experts that have an average of thirty years technical experience.

CYBERSOLV® Family of Cleaning Chemistries

CYBERSOLV® products have been specially formulated for superior performance in benchtop, stencil and maintenance cleaning. Whether for rework, oven cleaning or stencil cleaning Cybersolv will outperform anything in its class.