SMT Products and Services offered by KYZEN Corporation
MICRONOX® MX2302 Wafer-level Cleaning Solution
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages.
MICRONOX® MX2302 has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.
MICRONOX® MX2302 Key Benefits:
MICRONOX® MX2302 Applications:
MICRONOX® MX2302 has proven compatible with all materials commonly used in electronic assembly, wafer bumping and advanced packaging manufacturing and cleaning processes. For specific compatibility information, please contact your Kyzen representative.
Environmental, Health And Safety:
MICRONOX® MX2302 is a biodegradable, non-flammable, non-corrosive solvent. It contains no CFC’s or HAP’s.
MICRONOX® MX2302 is available in one (1) gallon, five (5) gallon and 55 gallon containers.
Semiconductor grade cleaning chemistries for defluxing and particulate removal for the Microelectronics and Semiconductor industries.
MICRONOX® MX2302 Wafer-level Cleaning Solution was added in Sep 2011
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