BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

Manufacturer of Assembly Equipment

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BTU Pyramax Convection Reflow Oven


BTU’s products excel in processes where precise control of atmosphere and temperature are critical to product yield. With over 10,000 units shipped, service and support in over 30 countries, and manufacturing facilities on two continents BTU is the leading choice for global manufacturers.


The World’s Best Performing Reflow Ovens

Pyramax OvensBTU’s Pyramax family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features BTU’s exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications Pyramax can provide O2 levels as low as 2ppm above source in the peak reflow zone.

Custom Furnaces: Made in the USA

BTU’s Controlled Atmosphere Furnace has the industry’s lowest Cost of Ownership and features process temperatures up to 1180°C. BTU’s automated thermal controls utilize segmented heaters to optimize thermal performance resulting in thermal uniformity better than +/-2°C. The system also features flexible atmosphere with Argon, Hydrogen, Nitrogen or forming gas available.

BTU International Postings

2 products »

PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

Eliminate reflow oven changeover time. The PYRAMAX ZeroTurn is designed for high volume electronics manufacturers who must also manage process mix and are dissatisfied with the poor process separation of other dual chamber machines.


PYRAMAX™ ZeroTurn Dual Chamber Reflow Oven

Pyramax - Convection Reflow Oven

BTU’s Pyramax™ family of high-throughput thermal processing system...


Pyramax - Convection Reflow Oven

3 technical articles »

Lead-Free Solder Wafer Bumping

Dec 06, 2007 | Fred Dimock, Kristen Mattson.

Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments in Europe and Asia have set deadlines to remove lead from consumer electronic devices that use printed circuit boards. Currently, the ban is not being applied to high reliability applications such as military or medical devices, but we all know that will come someday soon. Likewise many believe that lead free solder is coming to wafer bump reflow and are beginning to make the transition....

Making A Case for Continuous Furnaces

Nov 08, 2007 | Fred Dimock

A continuous furnace is ideal for processes requiring high production volumes, process consistency, and precision control. This overview discusses some of the newer temperature and atmosphere capabilities of continuous furnaces and addresses the various components that make up a continuous furnace....

Maximizing Process Control with Controlled Convection Rates

Oct 10, 2007 | Rob DiMatteo, Fred Dimock, Pierre LeMieux.

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection"....

215 news releases »

BTU Launches New Development at SMTAI to Support Industry 4.0

Aug 15, 2017 | BTU International will exhibit in Booth #430 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. BTU will showcase new technology to support Industry 4.0 during the two-day exhibition.

BTU Announces NextFlex as Its Newest Demo Site for the PYRAMAX Reflow Oven

May 16, 2017 | BTU International today announced that it has installed a PYRAMAX™ 100A demo unit at Silicon Valley-based NextFlex. A public-private consortium of companies, academic institutions, nonprofits and governments, NextFlex’s mission is to advance US manufacturing of flexible hybrid electronics (FHE). With this installation, BTU is now able to provide customer demonstrations on the West Coast, located conveniently in the heart of Silicon Valley.

BTU International Receives 30th Award for Advanced Thermal Processin

May 02, 2017 | BTU International, Inc., announces that it has been awarded a 2017 EM Asia Innovation Award in the category of Soldering Systems – Volume Soldering Systems (Reflow Soldering Equipment) for its PYRAMAX™ ZeroTurn Dual Chamber system. The award was presented to the company during an April 26, 2017 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

BTU’s New Dual Chamber Reflow System Awarde d during NEPCON China 2017

Apr 25, 2017 | BTU International announced that it received a 2017 SMT China Vision Award in the category of Reflow – Soldering for the PYRAMAX™ ZeroTurn Dual Chamber system. The award was presented to the company on April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

Apr 22, 2017 | BTU International today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging. The event is scheduled to take place May 16-18, 2017, in Nuremberg, Germany. BTU representatives will demonstrate the PYRAMAX™ reflow oven with the WINCON™ connected factory interface in booth 4-551.

BTU to Demo Its Dual Chamber Reflow Oven & Industry 4.0 Advances at NEPCON China

Mar 16, 2017 | BTU International will exhibit in 1E43 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. BTU will showcase the new PYRAMAX™ ZeroTurn Dual Chamber system and WINCON™ connected factory interface. The booth will also feature a PYRAMAX 150N.

BTU to Show New WINCON Interface Features at Southern Manufacturing

Mar 09, 2017 | BTU International today announced plans to exhibit in Booth H19 with Key Production Equipment Ltd. at the Southern Manufacturing & Electronics Exhibition. The event is scheduled to take place March 21-23, 2017 at FIVE in Farnbourough, UK. BTU representatives will showcase the PYRAMAX™ reflow oven with the WINCON™ connected factory interface.

BTU to Participate in “Making Reflow Ovens Smart” Panel Session at APEX

Feb 12, 2017 | BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will participate in a reflow panel during the IPC APEX EXPO. The panel session entitled, “Making Reflow Ovens Smart,” is scheduled to take place Thursday, Feb. 16, 2017 at 10 a.m.

BTU Set to Launch the PYRAMAX ZeroTurn Dual Chamber System at APEX

Jan 10, 2017 | BTU International today announced plans to make a major new product introduction at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. BTU will introduce the PYRAMAX ZeroTurn Dual Chamber system in booth #835.

BTU & SMarTsol to Demo RecipePro on PYRAMAX Oven at SMTA Guadalajara

Sep 12, 2016 | BTU International will exhibit with SMarTsol at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. BTU will showcase its RecipePro recipe generator software on a PYRAMAX system. RecipePro has been jointly developed with Electronic Controls Design Inc. (ECD).

205 more news releases from BTU International »

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