We enable OEMs to realize stronger competitive positioning by allowing them to focus on core R & D and branding initiatives that drive their own future growth, serving as a provider of choice for complete EMS solutions. We solve our customers' most challenging problems, and are renown for doing it better, faster and in a more cost-effective manner than the competition.
Our OEM customers leverage our services to meet their requirements throughout their products’ entire life cycles. The services we offer across all the markets we serve include:
- Design and Engineering Services;
- Original Design Manufacturing (ODM) Services;
- Components Design and Manufacturing;
- Systems Assembly and Manufacturing;
- Printed Circuit Board and Flexible Circuit Fabrication;
- After Sales Services.
Flex (Flextronics International) Postings
Jun 15, 2017 | Justin Zeng, Francoise Sarrazin, Jie Lian, Ph.D., Zhen (Jane) Feng, Ph.D., Lea Su, Dennis Willie, David Geiger - Flex International Inc., Masafumi Takada, Natsuki Sugaya - Hitachi Power Solutions, George Tint, Ph.D. - HDI Solutions
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.
First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces....
Oct 27, 2016 | Jose Becerra, Dennis Willie and Murad Kurwa
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors.
The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair.
This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted....
Sep 01, 2016 | Jennifer Nguyen, David Geiger and Murad Kurwa
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.
In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included....
Aug 18, 2016 | Omar García, Enrique Avelar, C. Sanchez, M. Carrillo, O. Mendoza, J. Medina, Zhen (Jane) Feng,Ph.D., Murad Kurwa
The Selective Reflow Rework Process is an approach to improving the high volume rework process, increasing process capabilities and process repeatability by using a standard reflow oven of 12 zones, pick and place machinery, semi-automated printing gear and Solder Paste Inspection (SPI) implementations. This approach was able to reduce the amount of rework equipment by more than half. Our human resource requirements (indirect and direct labor) were cut by more than 50% and our rolled throughput yield increased from 68.9% to 84.14%. The Selective Reflow Rework Process is less reliant upon operators and has become a repeatable, stable rework process....
Jun 23, 2016 | Michael Sumalinog, Jesus Tan, Murad Kurwa; AEG, Flex.
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.
This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA....
May 30, 2016 | Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D., Anwar Mohammed, Murad Kurwa, AEG, Flextronics, George Tint Ph. D., Saki America.
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes....
Apr 21, 2016 | David Geiger, Georgie Thein; AEG, Flextronics International Inc.
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.
This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc....
Dec 31, 2015 | Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flextronics International.
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost....
Nov 25, 2015 | Georgie Thein, David Geiger, and Murad Kurwa.
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available....
Sep 23, 2015 | Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad Kurwa
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment....
Jun 25, 2010 | Petra Solar, the clean tech company that links Smart Grid and solar and that pioneered grid-tied, pole-mounted, distributed solar generation systems for utilities, and Flextronics /quotes/comstock/15*!flex/quotes/nls/flex (FLEX 6.34, +0.06, +0.96%) , a leading global electronics manufacturing services provider, today announced Flextronics will build Petra Solar's SunWave(TM) smart energy modules for deployment around the world.
Mar 17, 2003 | Some 550 Flextronics workers in Italy have been rehired by a new company formed by Finmek and Sviluppo Italia, beginning June 1, 2003
Mar 05, 2003 | Flextronics International Ltd. said Monday, March 3, that private equity firm Silver Lake Partners has invested $200 million in the electronics contract manufacturer.
Feb 26, 2003 | The keynote address will be held on Wednesday, March 12, from 9 a.m. to 10 a.m. in Room N of the San Jose Convention Center.
Feb 12, 2003 | As Part of the Agreement, Xerox Sold Flextronics Certain Assets from Its Former Logistics Center
Jan 24, 2003 | The Company Also Announced a Change in Its Executive Management
May 07, 2002 | Will Soon be Implementing the Solution Across Global Manufacturing Sites Worldwide
Apr 30, 2002 | The Contract Manufacturer Just Reported a Q4 Profit of $5.7 Million
Apr 22, 2002 | Disappointing Because of Weakness Reported by a Competitor in Two Markets also Important to Flextronics
Apr 10, 2002 | Launched Its New Industrial Park in Shanghai Yesterday, Bringing the Concept of Electronics Manufacturing Services (EMS) to China