Agilent Medalist SP50 Series 3 - SPI
Company Information:
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Agilent Medalist SP50 Series 3 - SPI |
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Offered by: |
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Agilent Medalist SP50 Series 3 - SPI Description:
Automated 3D paste inspection for print process characterization, control and early defect prevention
Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is the latest generation in high performance 3D solder paste inspection. Opposing high incident angle lasers eliminate hidden paste, or “shadow effect”, regardless of paste deposit shape.
The SP50 Series 3 Features:
- Performs 100% 3D inspections giving whole deposit volume and location
- Identifies solder paste defects at the most cost effective process step
- Provides best-in-class performance using shadow free, dual laser technology
- Measurement data combined with statistical tools provides users with real-time process control
- Short programming time
- Lowest cost of ownership
Options:
- Offline programming (OLP) software
- Offline repair and SPC software - Medalist Repair Tool and Medalist Quality Tool
- Bar code readers - MicroScan 820 (1D)
- Uninterruptible power supply (UPS)
- Dual lane conveyor - (standard Series 3 machines only)
- Large board system indexing for up to 24 x 36” PWBs
- SJ50 Series 3 conversion kit - swappable lighting head for AOI inspection
- Small board staging - decreases handling time on smaller boards
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Functionality and capability: |
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2D and 3D solder paste |
Volume, area, height, XY offset, bridge measurement detection |
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Speed of operation Inspection speeds may vary with software setting changes; contact your Agilent sales representative for details. |
Fiducial inspection - Typically less than 5 seconds Load/unload - Typically less than 5 seconds 3D scanning speed - Up to 38.7 cm2/sec (6 in2/sec) |
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Gauge repeatable and reproducibility capability
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< 10% GR & R at typical process widths Typically 1% on target plate at 5.15 Sigma, ±50 μm spec Typically 5% on actual board at 5.15 Sigma, ±50 μm spec |
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Paste types supported |
All paste types, including lead-free |
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Board and pad finishes supported |
Typical pad fi nishes: HASL, Nickel Gold, organic, etc. Typical board fi nishes: all solder masks and colors |
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Board dimensions: |
SP50 Series 3 |
SP50 Series 3 XL |
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Maximum board size |
510 mm by 510 mm (20" by 20") |
610 mm by 610 mm (24" by 24") |
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Minimum board size |
50 mm by 50 mm (2" by 2") |
130 mm by 50 mm (5.11" by 2") |
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Maximum board thickness |
4 mm (0.16") |
15 mm (0.5") |
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Minimum board thickness |
0.5 mm (0.02") |
1.5 mm (0.06") |
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Maximum inspectable area |
495 mm by 495 mm (19.5" by 19.5") |
595 mm by 595 mm (23.5" by 23.5") |
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Board weight |
Up to 3 kg (6.6 lb) |
Up to 13 kg (28 lb) |
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Clearance
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6 mm (0.24") 50 mm (1.97") 3.5 mm (0.14") 821 mm to 965 mm (32" to 38") |
6 mm (0.24") 50 mm (1.97") 3.5 mm (0.14") 821 mm to 965 mm (32" to 38") |
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System dimensions: |
SP50 Series 3 |
SP50 Series 3 XL |
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Width |
1004 mm (3.3 ft) |
1210 mm (4 ft) |
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Depth |
1423 mm (4.7 ft)2 |
1423 mm (4.7 ft)2 |
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Height |
2210 mm (7.3 ft)3 |
2210 mm (7.3 ft)3 |
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Weight |
~1150 kg (2535 Ib) |
~1250 kg (2756 Ib) |
Agilent Medalist AOI Family
Both the Medalist SJ50 and SP50 Solder Paste Inspection (SPI) systems integrate key enabling technologies for a degree of accuracy and flexibility not previously seen in AOI. Interchangeable lighting heads and Agilent’s unprecedented unified platform technology allow the systems to be redeployed at paste, pre- or post-reflow as needs change. Find
Agilent Medalist SP50 Series 3 - SPI was added in Jul 2007
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