AIM Solder

AIM is a leading global manufacturer of solder assembly materials for the electronics industry.

Manufacturer

Superior Products | Experts in Process

With a legacy spanning more than eight decades, AIM has risen as a global powerhouse of innovation in electronic assembly materials, driven by the relentless passion of our exceptional team. IATF 16949, ISO 9001, ISO 14001 certified.

AIM's product line includes:

  • Solder Paste - No Clean, Rosin Based & Water Soluble Solder Paste.
  • Liquid & Paste Flux - No Clean, Rosin Based & Water Soluble Liquid & Paste Flux.
  • Cored & Solid Solder Wire - No Clean, Rosin Based & Water Soluble Cored Solder & Solid Solder Wire.
  • Alloys - AIM REL High Reliability Alloys, SN100C, Sn63/Pb37, SAC305 & More.
  • Bar Solder - Low Drossing, High Purity Solder Bar.
  • Specialty Materials - Indium, Tin, Lead, Bismuth, Cadmium, Gold and Gallium Solder Products.
  • Additional Solder Materials - Epoxies, Underfills, Chemicals & Cleaners.

Exceptional Service and Support

AIM is dedicated to offering personalized attention, ensuring that your unique needs are met with precision. Our technical support team is available 24/7 to assist you in achieving your manufacturing goals. We employ experienced engineers who are ready to answer your calls and address on-site challenges.

Global Presence

AIM boasts a global presence with locations in the USA, Canada, Mexico, South America, Europe, North Africa, China, and India. Wherever you operate, AIM representatives and technicians are readily available to provide product supply and support.

AIM Solder Postings

35 products »

LV05 No Clean Flux Cored Solder Wire

LV05 no clean flux cored wire is designed for use in high throughput, high volume electronics assembly processes. LV05 demonstrates consistent, rapid wetting required for robotic and rework/hand soldering operations while leaving safe post-solderi...

Solder Materials

LV05 No Clean Flux Cored Solder Wire

DJAW-10 Stencil Cleaner

Introducing DJAW-10, our efficient under stencil wipe solvent compatible with all AIM solder pastes. Ideal for manual or automated application, DJAW-10 reduces solder paste dry-out, enhances fine aperture release, and cuts wipe cycles by 50% compa...

Cleaning Agents

DJAW-10 Stencil Cleaner

REL22 High Reliability Lead-Free Solder Alloy

AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock...

Solder Materials

REL22 High Reliability Lead-Free Solder Alloy

REL61 Lead-Free Solder Alloy

AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and dro...

Solder Materials

REL61 Lead-Free Solder Alloy

RMA202-25 Flux

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin ba...

Solder Materials

RMA202-25 Flux

WS482 Cored Wire

WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standard or high temperature alloys....

Solder Materials

WS482 Cored Wire

WS716 Liquid Flux

WS716 is a halogen- and halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed f...

Solder Materials

WS716 Liquid Flux

WS715M Liquid Flux

WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux spray...

Solder Materials

WS715M Liquid Flux

RX18 No Clean Cored Wire Solder

RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes. Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated...

Solder Materials

RX18 No Clean Cored Wire Solder

FX16 No Clean Liquid Flux

FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and pa...

Solder Materials

FX16 No Clean Liquid Flux

See all products from AIM Solder »

14 technical articles »

AIM Tech Tip Article: Pretty Slick

Jun 20, 2022 | Timothy O'Ne i l l

We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations....

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Sep 26, 2018 | Carlos Tafoya, Gustavo Ramirez, Timothy O’Neill

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages....

A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Apr 13, 2017 | Karl Seelig, Tim O'Neill

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....

Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys

Feb 18, 2016 | Mehran Maalekian, Karl Seelig, Timothy O'Neill

As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability....

Conformal Coating over No Clean Flux Residues

Mar 04, 2015 | K.Seelig, T.O'Neill

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues....

Lead-Free Soldering Guide

May 12, 2014 | AIM

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter....

Head-in-Pillow BGA Defects

Nov 05, 2009 | Karl F. Seelig.

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress....

The Call for Halogen-Free Electronic Assemblies

Jun 17, 2009 | Karl Seelig, Michael Burgess.

The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.

This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed....

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Nov 20, 2008 | Karl Seelig, David Suraski.

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy....

Reflow Profiling: Time Above Liquidus

Dec 20, 2007 | David Suraski

Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed....

4 more technical articles from AIM Solder »

47 news releases »

AIM Solder Expands Technical Support in Mexico

Jan 29, 2014 | AIM Solder announces the appointment of Andrés Rojas to the position of Technical Support Engineer. Based out of Monterrey, Mexico, Andrés will assist in finding technical solutions for AIM customers within the Northeastern regions of Mexico.

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Jan 10, 2014 | AIM Solder is pleased to announce the appointment of Mr. Can Li to the position of Sales Manager. Effective 1 December, 2013, Li will be responsible for AIM’s sales development in the eastern and northern regions of China and will be based in Suzhou, China.

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Nov 08, 2013 | AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

Jul 10, 2013 | AIM Solder has been recognized by Philips Lighting China with Philips Lighting's 2013 Green Supplier Award during the Philips Lighting China Supplier Day in Shanghai, China in large part due to the company’s participation in the Conflict-Free Tin Initiative (CFTI).

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 13, 2013 | AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

May 07, 2013 | AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 30, 2013 | AIM Solder has added PHASE 4, Inc. as its representative for the complete AIM line of solder assembly materials in Arizona and New Mexico.

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 25, 2013 | AIM Solder announces the addition of Rich Sales Co. as its representative for the complete AIM line of solder assembly materials in Arkansas, Louisiana, Oklahoma and Texas.

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 19, 2013 | AIM Metals & Alloys LP, announces that its Montréal facility has been awarded ISO 14001:2004 certification in Environmental Management Systems. ISO® (International Organization for Standardization) 14001:2004 is an internationally recognized set of standards that sets out a framework for an organization to develop and implement policies and objectives for setting up an effective environmental management system.

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Apr 08, 2013 | AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

37 more news releases from AIM Solder »

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