AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Manufacturer of Assembly Material, Soldering

AIM offers a full product line to the electronics industry that includes solder paste, liquid flux, wire solder, bar solder, plating anodes, adhesive, spheres, preforms, chemicals, and cleaners. AIM is ISO and QS9000 certified with manufacturing and distribution facilities in Canada, USA, Mexico, Europe, Asia, Australia, and South Africa.

AIM's product line includes a full range of solder products and a wide variety of lead-free solder alloys:

  • Lead-Free - lead-free alloys, solder pastes and cored wires.
  • No Clean - no-clean solder paste, liquid flux, wire solder, paste flux.
  • Water Soluble - water soluble solder paste, liquid flux, wire solder, paste flux.
  • Rosin Based - RMA & RA solder paste, liquid flux, wire solder, paste flux.
  • Chemicals & Cleaners - flux thinner, stencil cleaners, saponifiers.
  • Specialty Materials - Indium, gold and other specialty solders, preforms, fusible alloys, seals, compounds, target materials, test kit.
  • Bars & Anodes - bar solder, plating anodes.
  • Adhesives - surface mount adhesive, uUnderfill.
  • Miscellaneous - descaler, defoamer, deox powder, titration kit.
  • Alloys - common, specialty (high- and low-temperature), and lead-free alloys.

Global Manufacturing And Support

AIM is well-equipped to handle the growing need for quality solder products, support and service around the globe. With a manufacturing and support presence throughout the Americas, Europe, Asia and Australia, AIM's rapidly expanding family of customers is assured of a level of quality, consistency and dependability unsurpassed in the electronics industry.

AIM Solder Postings
44 products »
High Melting Point Solder Alloys

Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of t...

Solder Materials

High Melting Point Solder Alloys
SN100C - Lead-Free Solder Alloy

Best choice for lead-free wave soldering. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven ...

Solder Materials

SN100C - Lead-Free Solder Alloy
SAC305 Lead-Free Solder Alloy

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as c...

Solder Materials

 SAC305 Lead-Free Solder Alloy
Sn63/Pb37 Electropure™ High Purity Solder Alloy

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended o...

Solder Materials

Sn63/Pb37 Electropure™ High Purity Solder Alloy
DJAW-10 Stencil Cleaner

DJAW-10 is a long chained alcohol based stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes. DJAW-10 is formulated for application by hand or automated dispensing equipment. Unlike other stenci...

Cleaning Agents

DJAW-10 Stencil Cleaner
200AX Stencil Cleaner - Hand Application

A solvent blend stencil cleaner with a concentrated additive that is 100% compatible with all AIM solder pastes and epoxies. 200AX is formulated for application by hand. Where automatic application is desired, AIM’s DJAW Stencil Cleaner...

Cleaning Agents

200AX Stencil Cleaner  - Hand Application
AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner

AIMTERGE 6035 cleaner is a saponifier formulated to readily remove resin, rosin, no clean and water soluble flux residues from printed circuit boards, while preventing the attack of components and aluminum hardware common with many saponifers. The...

Cleaning Agents

AIMTERGE 6035 Solder Paste, Flux and Wire Residues Cleaner
Common Flux Thinner

Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residu...

Solder Materials

Common Flux Thinner
Underfill FF35

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Und...

Materials

Underfill FF35
Surface Mount Epoxy 4089

Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equ...

Dispensing

Surface Mount Epoxy 4089
RMA Mildly Activated, General-Purpose Cored Solder Wire

RMA is a mildly activated, general-purpose wire solder for use in applications requiring good activation. RMA cored wire is active enough for excellent tarnish or oxide removal, and will produce bright shiny solder joints. RMA wire will leave slig...

Solder Materials

RMA Mildly Activated, General-Purpose Cored Solder Wire
RA-301 Fully Activated, Rosin-Based Flux

RA-301 is a fully activated rosin-based flux formulation containing 35% solids. RA-301 has a very wide process window, which makes it an acceptable alternative to a variety of environments and process applications. RA-301 has a high activity level...

Solder Materials

RA-301 Fully Activated, Rosin-Based Flux
RMA202-25 Medium Solids, Mildly Activated Flux

RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin ba...

Solder Materials

RMA202-25 Medium Solids, Mildly Activated Flux
WS Water Washable Tacky/Rework Paste Flux

AIM WS Paste Flux is a water washable tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM WS Paste Flux may be used for general touch up or rework of printed circuit boards, a...

Solder Materials

WS Water Washable Tacky/Rework Paste Flux
OAJ Cored Wire

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wett...

Solder Materials

OAJ Cored Wire
WS730 High-Activity, Water Soluble Liquid Flux

WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, c...

Solder Materials

WS730 High-Activity, Water Soluble Liquid Flux
WS770 VOC-Free, Water-Soluble Liquid Flux

WS770 is a PH neutral, organically activated, water-based, VOC-free water-soluble liquid flux formulated to fully atomize during the wave soldering process. WS770 may be applied by automated flux sprayers, foamed, dipped, or brushed on w...

Solder Materials

WS770 VOC-Free, Water-Soluble Liquid Flux
WS715M Rosin-Free, Water Soluble Liquid Flux For Wave Solder Applications

WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux spray...

Solder Materials

WS715M Rosin-Free, Water Soluble Liquid Flux For Wave Solder Applications
WS735 Water-Soluble Liquid Flux For Wave Solder Applications

WS735 is an alcohol based, organically activated, water-soluble liquid flux designed specifically for wave solder applications. WS735 may be applied by automated flux sprayers, foamed, dipped, or brushed on with favorable results. WS735 is active ...

Solder Materials

WS735 Water-Soluble Liquid Flux For Wave Solder Applications
NC265LR Low-Residue Liquid Spray Flux

IPA-based, low-residue flux for spraying applications. Low-Residue Rosin- and Resin-Free Fast Wetting for SN100C & SAC Alloys Lead-Free & Tin-Lead Compatible Halide-...

Solder Materials

NC265LR Low-Residue Liquid Spray Flux
NC265 Liquid Flux For Foaming or Spraying Applications

IPA-based flux for foaming or spraying applications. Rosin/Resin Free Low Post-Process Residues Broad process window Fast wetting for SN100C & SAC alloys Lead-free & tin-lead ...

Solder Materials

NC265 Liquid Flux For Foaming or Spraying Applications
NC520 Lead-Free & Tin-Lead Solder Paste

For Use with Demanding High Density Electronic Assemblies. NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding.&nbs...

Solder Materials

NC520 Lead-Free & Tin-Lead Solder Paste
NC No-Clean Tacky/Rework Solder Paste Flux

NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for att...

Solder Materials

NC No-Clean Tacky/Rework Solder Paste Flux
NC217 Lead-Free & Tin-Lead Gel Flux

NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source.  NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat ...

Solder Materials

NC217 Lead-Free & Tin-Lead Gel Flux
NC263UR Rosin/Resin Free Liquid Flux

NC263UR is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to promote enhanced wetting during the wave soldering process. NC263UR has a higher activity level and lower surface tension than other no-clean liquid fluxes. NC...

Solder Materials

NC263UR Rosin/Resin Free Liquid Flux
NC277 Voc-Free Liquid Flux

NC277 Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC277 has an exceptionally durable and powerful activator system ma...

Solder Materials

NC277 Voc-Free Liquid Flux
NC275LR Low-Residue Voc-Free Liquid Flux

NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excellent...

Solder Materials

 NC275LR Low-Residue Voc-Free Liquid Flux
NC257MD Jet Printing Solder Paste for MyData MY500 Jet Printer.

NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits.    ...

Solder Materials

NC257MD Jet Printing Solder Paste for MyData MY500 Jet Printer.
NC273LT Solder Paste For Bismuth Bearing Alloys

AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low tempe...

Solder Materials

NC273LT Solder Paste For Bismuth Bearing Alloys
NC254 Lead-Free & Tin/Lead Dispensing Solder Paste

NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs.  NC254 has been developed to offer extremely broad process windows for pr...

Solder Materials

NC254 Lead-Free & Tin/Lead Dispensing Solder Paste
M8 No Clean, Halogen-Free Solder Paste

AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305 and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successf...

Solder Materials

M8 No Clean, Halogen-Free Solder Paste
NC259 Lead-Free, Halogen-Free Solder Paste

AIM is pleased to offer NC259 Solder Paste designed specifically for use with SN100C® and other no- and low-silver alloys. NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and hig...

Solder Materials

NC259 Lead-Free, Halogen-Free Solder Paste
RA (Rosin Activated) Cored Wire

Rosin Activated Cored Wire Solder RA is a fully activated, general-purpose wire solder for use in applications where mildly activated fluxes are too weak. RA cored wire is strong enough for excellent tarnish and oxide removal, and ...

Solder Materials

RA (Rosin Activated) Cored Wire
NC280 Low-Residue Liquid Rework Flux

NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning.  NC280 offers an excellent activity level with good performance on bare copper, solder coated and ...

Solder Materials

NC280 Low-Residue Liquid Rework Flux
Surface Mount Epoxy 4044

Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense ...

Dispensing

Surface Mount Epoxy 4044
GLOW CORE Cored Wire - No-Clean Flux Solder Wire

Glow Core is a no-clean, halide-free, resin-based flux cored wire solder designed to offer excellent wetting characteristics and lead-free compatibility. This product is very active and is recommended for fast cycle time soldering. Glow Core fl...

Solder Materials

GLOW CORE Cored Wire - No-Clean Flux Solder Wire
WS488 Water Soluble Solder Paste

AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8...

Solder Materials

WS488 Water Soluble Solder Paste
One-Step Underfill 688

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-st...

Materials

One-Step Underfill 688
NC275LR Low-Residue Liquid Flux

NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excell...

Solder Materials

NC275LR Low-Residue Liquid Flux
RMA258-15R Rosin Based Solder Paste

RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. RMA258-15R reduces such defects as voiding and eliminates head-in-pi...

Solder Materials

RMA258-15R Rosin Based Solder Paste
WS482 - Water Soluble, Halide-free Flux Cored Wire

WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste chemistries. WS482 offers improved thermal stability, allowing it to be processed with standa...

Solder Materials

WS482 - Water Soluble, Halide-free Flux Cored Wire
NC264-5 No Clean Liquid Flux

An alcohol based, halide free, no-clean liquid flux designed specifically to have a very wide process window for wave solder applications. Recommended for tin-lead and lead-free wave soldering applications. Especially suitable for foaming appli...

Solder Materials

NC264-5 No Clean Liquid Flux
WS716 Water Soluble Liquid Flux for Wave Solder Applications

WS-716 is a halide-free, alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. WS716 is the liquid version of the WS-477S1 series solder paste. Though designed f...

Solder Materials

WS716 Water Soluble Liquid Flux for Wave Solder Applications
NC258 Lead-Free & Tin-Lead Solder Paste

Solving the Most Challenging Lead-Free Application Problems AIM's newest product, its NC258 No-Clean Solder Paste, offers one of the longest pause-to-print windows in the industry and also enhances fine print definitions. Furth...

Solder Materials

NC258 Lead-Free & Tin-Lead Solder Paste
12 technical articles »
A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Apr 13, 2017 | Karl Seelig, Tim O'Neill

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....

Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys

Feb 18, 2016 | Mehran Maalekian, Karl Seelig, Timothy O'Neill

As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability....

Conformal Coating over No Clean Flux Residues

Mar 04, 2015 | K.Seelig, T.O'Neill

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues....

Lead-Free Soldering Guide

May 12, 2014 | AIM

The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What was once an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter....

Head-in-Pillow BGA Defects

Nov 05, 2009 | Karl F. Seelig.

Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress....

The Call for Halogen-Free Electronic Assemblies

Jun 17, 2009 | Karl Seelig, Michael Burgess.

The increased interest in halogen-free assemblies is a result of Non-Government Organizations (NGOs) exerting pressure on electronic equipment manufacturers to eliminate halogens. The NGOs primary focus is on resolving global environmental issues and concerns. As a result of an increase in the enormous "e-waste" dump sites that have begun showing up around the world, NGOs are pushing consumer electronic manufacturers to ban halogen-containing material in order to produce "green" products. Not only are these sites enormous, but the recycling methods are archaic and sometimes even illegal.

This stockpiling and dumping has created growing political and environmental issues. In order to deal with this issue, the question of why halogens are a focal point must be addressed....

Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder

Nov 20, 2008 | Karl Seelig, David Suraski.

The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy....

Reflow Profiling: Time Above Liquidus

Dec 20, 2007 | David Suraski

Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed....

A Practical Guide to Achieving Lead-Free Electronics Assembly

Oct 18, 2007 | Karl Seelig, David Suraski

To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection....

A Study of Lead-Free Wave Soldering

May 02, 2007 | David Suraski.

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering....

2 more technical article(s) from AIM Solder »

47 news releases »
AIM Solder Expands Technical Support in Mexico

Jan 29, 2014 | AIM Solder announces the appointment of Andrés Rojas to the position of Technical Support Engineer. Based out of Monterrey, Mexico, Andrés will assist in finding technical solutions for AIM customers within the Northeastern regions of Mexico.

AIM Solder Announces Appointment of Can Li as Sales Manager of Northern China

Jan 10, 2014 | AIM Solder is pleased to announce the appointment of Mr. Can Li to the position of Sales Manager. Effective 1 December, 2013, Li will be responsible for AIM’s sales development in the eastern and northern regions of China and will be based in Suzhou, China.

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Nov 08, 2013 | AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

AIM Pleased to be Presented the 2013 Green Supplier Award from Philips Lighting

Jul 10, 2013 | AIM Solder has been recognized by Philips Lighting China with Philips Lighting's 2013 Green Supplier Award during the Philips Lighting China Supplier Day in Shanghai, China in large part due to the company’s participation in the Conflict-Free Tin Initiative (CFTI).

AIM Solder Announces the Release of NC277 VOC-free Liquid Flux

May 13, 2013 | AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.

AIM Solder’s NC259 Solder Paste Offers Superior Performance

May 07, 2013 | AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.

AIM Solder Announces Appointment of Sales Representative, PHASE 4, Inc.

Apr 30, 2013 | AIM Solder has added PHASE 4, Inc. as its representative for the complete AIM line of solder assembly materials in Arizona and New Mexico.

AIM Solder Announces Appointment of Sales Representative, Rich Sales Co.

Apr 25, 2013 | AIM Solder announces the addition of Rich Sales Co. as its representative for the complete AIM line of solder assembly materials in Arkansas, Louisiana, Oklahoma and Texas.

AIM Solder Receives Environmental ISO 14001:2004 Certification

Apr 19, 2013 | AIM Metals & Alloys LP, announces that its Montréal facility has been awarded ISO 14001:2004 certification in Environmental Management Systems. ISO® (International Organization for Standardization) 14001:2004 is an internationally recognized set of standards that sets out a framework for an organization to develop and implement policies and objectives for setting up an effective environmental management system.

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Apr 08, 2013 | AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

37 more news releases from AIM Solder »

Contact information

AIM Solder

9100 Henri Bourassa Est.
Montreal, Quebec, H1E 2S4
Canada

  • Phone +1-514-494-2000

Visit AIM Solder website

Mexico

AIM-Soldadura de Mexico

Calle Chimeneas 5050
Parque Industrial Juarez
Juarez, 32360, Mexico

  • Phone +52-656-630-0032
  • Fax +52-656-630-2921

USA

AIM Solder

25 Kenney Drive
Cranston, Rhode Island, 02920, USA

  • Phone +1-401-463-5605
  • Fax +1-401-463-0203

Europe

AIM Solder Sp. z o.o.

ul. Papiernicza 7
Łódź, 92-312, Poland

  • Phone +48-502-190-802

Asia-Pacific - Shenzhen, China

AIM Solder (Shenzhen). Company Limited

No. 264 Xiangshan Road Luotian Village, Songgang Town Baoan District
Shenzhen, 518105, China

  • Phone +86-755-2993-6487

Asia - Bangalore, India

AIM Solder India

# 84, 3rd cross, Govinda Reddy Layout, Near Arekere Mico Layout, Bannerghatta Main Road
Bangalore, 560076, India

  • Phone +91-804-155-4753
Fluid Dispense Pump Integration

 Reflow System