Oak Mitsui Inc. Products

SMT Products and Services offered by Oak Mitsui Inc.

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Oak Mitsui Inc.
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Oak Mitsui Inc. Products

Oak-Mitsui specializes in the development and production of world class performance foils, Aluminum Bonded Copper, and FaradFlex� Buried Capacitance� materials. »»

Headquarters: Camden, South Carolina, USA

Manufacturer

4 listed by Oak Mitsui Inc.

Product	Category
FaradFlex� - Materials for Embedded Capacitance Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free...
MicroThin� - Ultrathin Foils for Fine Lines/Spaces Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin�. MicroThin� is a very low profile copper 3�m or 5�m copper foil with an 18�m or 35�m peelable copper carrier for high-density circui...
Aluminum Bonded Copper Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical metal surfaces are cleaned then bonded without t...
Copper Foils Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and application specific copper foils required by ...

Product

FaradFlex� - Materials for Embedded Capacitance

Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free...

MicroThin� - Ultrathin Foils for Fine Lines/Spaces

Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin�. MicroThin� is a very low profile copper 3�m or 5�m copper foil with an 18�m or 35�m peelable copper carrier for high-density circui...

Aluminum Bonded Copper

Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical metal surfaces are cleaned then bonded without t...

Copper Foils

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and application specific copper foils required by ...