Synova S.A. Products

SMT Products and Services offered by Synova S.A.

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Synova S.A.
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Synova S.A. Products

Synova is an experienced manufacturer of innovative laser cutting systems for an extraordinary range of micro-machining and dicing applications. »»

Headquarters: Ecublens, Switzerland

Manufacturer

4 listed by Synova S.A.

Product	Category
Laser Cutting Systems The LCS 300 has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The LCS is manually loaded, and includes an automatic work piece vision alignment system. The work piece is fixed on a M6-thread table. For more informat...
Laser Stencil Systems The LSS is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size. The machine has a Gerber interface and the data can be automatically transferred to the NC controller. For more information please visi...
Laser Grinding Systems The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website...
LDS � Laser Dicing Systems The LDS 200 A is a fully automatic, cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness). For more information please visit our website...

Product

Laser Cutting Systems

The LCS 300 has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The LCS is manually loaded, and includes an automatic work piece vision alignment system. The work piece is fixed on a M6-thread table. For more informat...

Laser Stencil Systems

The LSS is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size. The machine has a Gerber interface and the data can be automatically transferred to the NC controller. For more information please visi...

Laser Grinding Systems

The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website...

LDS � Laser Dicing Systems

The LDS 200 A is a fully automatic, cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness). For more information please visit our website...