ZM-R8650C BGA & SMD Rework Station

R8650C BGA Rework Station

R8650C is a fully automatic visual alignment BGA rework station, suitable for automatic visual placement of various chip o large PCB boards (such as 5G communication boards), automatic welding and automatic desoldering. It can be combined with SAP/ERP to realize the temperature curve analysis with S/N as retroactive condition.

Features:

  • Power Supply AC380V±10% 50/60Hz
  • Heater power Top heater 800W, bottom 800W, IR 5000W
  • Total power 21.25KW Upper temperature zone(1.45KW ) Power Lower temperature zone(2KW) Other power(1.8KW) � Preheating temperature zone(16KW
  • PCB size 670x570mm(Max) ; 10x10mm(Min)
  • BGA Chip Size 100x100mm(Max) ; 1x1mm(Min)
  • IR Temp. Zone Size 645x524mm
  • Motion Control X/Y/Z
  • External Temp. Sensor 6 PCS
  • Control System Industrial PC+Servo motion control system
  • Display System 24" SD display
  • Alignment System SM pixels d1g1tal HD industrial camera+ 1.3M pixels Industrial camera with telecentric auto-correction alignment
  • Vacuum adsorption Full automatic
  • Alignment Accuracy ±0.0lmm
  • Temp. Control K·type thermocouple(closed-loop), intelligent temperature compensation system with accuracy up to ± 1° c
  • Feeding Device Semi-automatic
  • Positioning V-groove with universal fixture(shaped fixture can be customized)
  • Dimensions L 1235xW1215xH1850mm
  • Weight 660KG

Accessories Include:

  • PCB support fixture
  • BGA support frame
  • Nozzle
  • Vacuum Nozzle

 

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