Electronics Assembly Jobs

Microelectronic Assembly Technician

Date Posted:

December 18, 2016

Job Category:

Production

Location:

Littleton, Colorado, USA

Willing to Relocate?:

Yes

Summary of Qualifications:

Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors. 

Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 certification.

Experience in fabricating wire harnesses and cables on panels, modules and chassis.

Read and understand electro- mechanical drawings, wire bond diagrams &work instructions.

Skilled at DATACON DieAttach, RF ManualBonding: Ball-Ribbon-Wedge Wire bondings, thermo compression die bonding, ultrasonic and parallel gap micro welding and soldering.

Set up temperature probes and hot plate. Perform bond pull and die sheer before bonding.

Proficiency in the West Bond Model 4700E, Westbond 7400A Thermosonic Wedge Bonding system, Delvotec G5 and Palomar Wire Bonders. Use DATACON - Foton Die Attach, DVMs, Caliper,LCR meter, HighPower Microscope,Frequency Counter, Spectrum Analyzer.

Excellent hand eye coordination (manual dexterity). Detail oriented and accurate.

Knowledge of MIL-PRF-38534, MIL-STD-883, MIL-STD-750. Basic computer skills.

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