Summary of Qualifications: |
� Exposure to Siemens Pick & Place M/Cs.
� Basic knowledge in POP components, 01005 component package.
� Exposure in SIX SIGMA TOOLS � WHITE BELT.
� Performing DFM for the new products & running products.
� Exposure in screen printers
� De-hart / Elite6920 / MPM / UP2000.
� Basic knowledge in Pick & Place machines
� YM66 / YM84 / YV100 / Sanyo TCM1000
� Exposure in re-flow ovens
� Heller1500 / Heller1800 / Conceptronics / BTU / Electrovert / Omni Flow.
� Exposure in Wave Soldering machines & Process.
� Electrovert (4 Preheaters, 5 Preheaters, ), Omni flow.
� Exposure in CLEAN & NO CLEAN PROCESS.
� Exposure in batch cleaning processes
� NuClean Aqueous cleaning machine / Crest cleaning machine.
� Scrap reduction in Flex Cable Board Assembly (FCBA).
� Reduction of tomb stoning (0402 component) in FCBAs.
� Knowledge in fine pitch devices like QFP, SOIC's of 12 & 20 thou pitches.
� Exposure in stencil designing (Making step etched stencils).
� Exposure in Bandit rework machine (For BGA rework).
� Exposure in handling BGA (Ball Grid Array) for reworking.
� Exposure in designing stencils for re-balling of BGAs (Ball Grid Array).
� Basic Knowledge in LEAD FREE SOLDERING.
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