Summary of Qualifications: |
I am currently pursuing my Master's degree in Mechanical Engineering at
the State University of New York at Binghamton, NY and expect to graduate
by May 2000. I have been working as a Graduate Research Associate since
August 1998, for the CSP/DCA Consortium at Universal Instruments
Corporation, Binghamton, NY, where my research has primarily been in the
area of Finite Element Analysis (FEA). Here, I have had the opportunity
to perform non-linear thermo-mechanical analyses for complex electronic
packaging assemblies using ANSYS 5.5.
I also worked at C&D Technologies, Inc., Conshohocken, PA as a summer
intern where my work involved the extensive use of AutoCAD� R14 for the
preparation of assembly and part drawings.
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