Summary of Qualifications: |
Equipment Engineer for Fuji, DEK, MPM, and BTU reflow. Strengths include machine programming, process development, project management, and line layout design. Worked for the leading company of the contract manufacturing industry for over four years -- in both manufacturing and R&D functions. Independent self-starter with ability to lead team members.
PROFESSIONAL EXPERIENCE
Solectron Corporation 1997 - 2001
Solectron High Velocity Systems Division, Newark, CA
Manufacturing Engineer (1997 - 1999)
Responsibilities:
1) Developed assembly procedures for Hewlett-Packard DeskJet printer chassis, Intel and Sony personal computers, Whistle Internet appliance, and various packaging assemblies.
2) Designed, optimized manufacturing line layouts for Internet appliance and for final box packaging assemblies for Sun Microsystems, Apple Computers, and Synnex Technologies.
3) Conducted time study analysis and ergonomic assessments.
4) Supported PC motherboard and hard drive testing and system burn-in processes.
5) Resolved product quality issues and other material discrepancies.
6) Participated in cross-functional teams comprised of Program Managers, Quality Engineers, Buyers/Planners, and Production Management.
Accomplishments:
1) Successfully transferred product to new facility and redesigned line layout and process, while simultaneously reducing manufacturing cycle time by at least 30%.
2) Improved packaging line efficiency and productivity, resulting in commendation from Operations Manager.
3) Promoted with salary bonus after first year and given additional Whistle Communications project.
Solectron Technical Center, Milpitas, CA
Mechanical Engineer (1999 - 2001)
Responsibilities:
1) Plan and execute technical evaluations and tests of component placement machines, stencil cleaners, and stencil printer technologies.
2) Create and debug Fuji machine programs using Unicam software at New Product Introduction (NPI) Center and coordinate worldwide user group for software development issues.
3) Conduct statistical analysis of solder paste print volume data.
4) Facilitate user meetings with machine vendors on performance, service and software issues.
Accomplishments:
1) Managed new equipment evaluation and assessment project, resulting in machine approval for company-wide vendor list.
2) Promoted with salary bonus after successfully executing stencil cleaner evaluation.
3) Derived optimum settings for solder paste printing technologies through Design of Experiments, and presented results at the 2000 worldwide Technology Exchange Conference.
4) Generated operation and maintenance manuals for Surface Mount Technology screen printers and reflow oven.
TECHNICAL SKILLS
AutoCAD Certified for Levels 1 and 2, Copper Connection Training Center
Certified FujiCAM/Unicam Software Programmer, Fuji America Training Center
Design of Experiments (DOE) using Statistica and JMP statistical software
Statistical Process Control (SPC), Solectron University
EDUCATION
B.S. Mechanical Engineering, 1997
University of California, Davis
ACTIVITIES
President, Fremont youth program organization (1999 - 2001)
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