International Sales Manager

With 8 years experience in the electronics industry I have in-depth technical understanding of the full SMT production process and related materials and technologies as die attach. I regularly trouble shoot SMT processes for customers, providing effective technical solutions. I spend much of my time on site with customers in Europe, providing technical knowledge and making sales. I work well at all levels in the industry and need little or no support, as I am able to operate well in a sales,management role and equally as well in a technical support scenario.

Curriculum Vitae Tanu Niemi Tanhuankatu 11 b 9 20540, Turku Finland Europe Telephone: Home: +358 2 2372472 Work: +358 2 2530348 Mobile: +358 40 866 8889 E-mail: tanu.niemi@kolumbus.fi Date of Birth: 20.12.73 Common-law Two children Finnish CAREER HISTORY: 1999 � Present day. Company: OMG Assembly Materials Division Current Position: Technical Sales Manager/Application Engineer of Assembly Materials Division Initially responsible for development of the European market for OMG Microbond solder paste products. Acquisition, establishment and training of 6 distributors for solder paste products throughout Europe. Responsible for following aspects of business development in Europe marketing and technical support. With 8 years experience in the electronics industry I have in-depth technical understanding of the full SMT production process and related materials and technologies as die attach. I regularly trouble shoot SMT processes for customers, providing effective technical solutions. I spend much of my time on site with customers in Europe, providing technical knowledge and making sales. I work well at all levels in the industry and need little or no support, as I am able to operate well in a sales role and equally as well in a technical support scenario. 1998-1999 Company: UpTech Norden Position held: SALES MANAGER. UpTech Norden Representative company from Sweden. My position was a Technical Sales Manager). I grew business in Finland during my time with UpTech. I was involved with the electronic production process from solderpaste, printing and reflow, cleaning..Also experience of Vision systems and x-ray systems. Responsible for sales and technical support of all customers and all product lines in the Finland. Experience Gained:I gained a great deal of in depth information and experience from working with the experts in each field of the SMT production process.Finding a good representative companies and Supporting them.Also backside replacing representatives that are not active in their region. 1994 - 1998 Company: Nokia Mobile Phones ltd. Position held: SMT Technician Responsibilities involved technical support for production lines and operators. Weekly,Monthly and 6 month maintenances were also in our responsibility. 1993-1994 Finnish Military FINNISH EDUCATION: Studies of Heating and ventalation 2 years Electronics(components) 6 months Nokia in-House training in Components and production equipment as Printers,dispensers Pick&Place, Reflow and PCB handling systems four(4) years. Professional Training UpTech Norden OMG Solder paste applications. Languages: Finnish Mother Tonque English Fluent Swedish Fair Skills: I have skills for marketings and sales of capital equipment products and I have done quotations and year contracts with Finnish and Estonians companies. I have worked with principals of Europeans and Americans companies and I have been a link with customers both principals and specialists. I have marketed and sold capital equipment products for Printed Circuit Boards to SMT business areas , there are machines and full manufacturing of electronic lines (loaders, conveyors, paste printers, placement machines of chips and fine pitch components, reflow- and wave soldering ovens and unloaders). Interests: Golf, Downhill Skiing, Running,Gym,Reading(Electronics)