Manufacturing Engineer, Senior 10 yrs Exp

Carreer Objective:

A Process Engineering/NPI position that utilizes my experience and provides an opportunity for personal & professional growth.

Objective: A Process Engineering/NPI position that utilizes my experience and provides an opportunity for personal & professional growth. Professional Experience: Senior Manufacturing Engineer - Pacific Scientific Wilmington, MA 1/01-Present Provide Mfg Engineering Support for the PacSci Industrial Drive Electronics Group. Supporting - All surface Mount Processes,NPI,Component Specification, Vendor Approvals, etc. Supported Equip: UIC GSM1,MPM AP20-UP2000,Omniflow 5,Etc. Senior Product/Process Engineer- Ericsson Inc., Lynchburg Va. 3/96-12/00 Provided Process/Product Engineering Support for a surface mount operation producing 4.5 Million Cellular Phones per year. Responsible for overall product quality/quantity in the multiband cellular market. Helped to double the production level in Lynchburg over a 16 monthperiod. Process Responsibilities: --Technical Leader for Philips FCM Machines. --Technical Leader for Universal GSM 2 Machines. --Equipment Utilization/Throughput Improvements. --Interface with/Train Operations & Maintenance personnel on machine operation & troubleshooting. Product Responsibilities: Object Leader (SMA) for Multiband cellular (Digital/PCS) production in Lynchburg. Interface with Production/Project management to determine Line Rates/Capacities based on product demand. Work with design on PCB related design issues. Projects: Drafted Machine Acceptance Criteria for all Philips & Universal Equipment. Helped Implement a new standard line configuration to maximize throughput/quality. Created Standardized Machine Configurations/Databases for GSM/FCM equipment. Worked with the board design team to help optimize our standard panel Layout for maximum throughput. Worked with R&D to specify/modify Component Packaging/Environmental Requirements SMA Equipment Experience: Panasonic Placement Equipment (MV2C/MV2F, MPA3/MPA3F/MPAV) Phillips FCM16 Base 1 GSM 2 (Flex & NCC8 Heads) Solder paste printing (MPM AP-25/UP 3000) Camalot 2800/3800 Solder Reflow/Profiling (Electrovert Air Convection Ovens) Surface Mount Mfg Support Engineer - Delco Electronics, Kokomo IN 7/95 - 12/95 Provided second shift process support for an operation producing approximately 4 million engine control modules per year. Process Responsibilities: --Automated PCB X-Ray Inspection. --Fine Pitch Component Placement. --Solder Paste Printing. Projects: Developed a standard set of X-ray Algorithm rules to catch placement defects. Helped to create a relational database to correlate X-ray defects to a particular process. SMA Equipment Experience: Solder Paste Application ( MPM UP3000 ) Surface Mount Component Placement ( Phillips MCM VII 5* ) Fine Pitch Component Placement ( TDK SS1/GSM 1) IR Reflow & Cure Oven ( Vitronics 700 ) X-ray Automated Solder Joint Inspection ( IRT 5600 ) Adhesive Application ( Phillips HW Glue ) Product Support Engineer - Utility Test Equipment Co. , West Lafayette IN 7/92 - 4/95 Provided Manufacturing support for the production of automated test equipment used in the electric utility industry. Responsibilities: Product Repair/Troubleshooting to the component level Final Product Testing/Quality Assurance Support of assembly equipment hardware/software Equipment Calibration Prototype Product Construction Assembly Fixture Design PTH + Wave Soldering Projects: Implemented wave solder/board washing processes. Standardized the documentation for the acceptance/testing of finished products. Established ESD Procedures for the Assembly area. Education: B.S. EET Purdue University Calumet, Hammond IN , 1990 A.S. EET Vincennes University, Vincennes IN Honors Graduate, 1987 Memberships: SMTA Member 1995 - Present Purdue Alumni Association References : Provided Upon Request.