Product Engineer - BGA Packages

Tektronix Component Solutions is committed to supplying customers with solutions to their most challenging microelectronic assembly and testing requirements.  Our mission is to provide our customers a complete solution for their custom packaging needs through design, development, and manufacturing services.

 

The Product Engineer is responsible for life-cycle management of products from production release through end-of-life, including all technical aspects that affect product cost, quality, and performance. These products are custom components used in higher level assemblies and consist of hybrids, BGAs, and multichip modules.  The successful candidate is the primary technical contact for these products and will provide cross-functional leadership to address overall product management.

 

Specific responsibilities include:

- Monitor, analyze, and improve product yields

- Identify and execute opportunities for gross margin improvement

- Maintain product cost models

- Serve as primary contact for customer technical assistance

- Lead product modification projects

- Provide focal point leadership for resolving manufacturing issues

- Maintain product documentation

The successful candidate will be a self-starter with a proven ability to work in a fast-paced, small-company, team environment.  Direct experience with manufacturing operations and familiarity with microelectronic components is important.  Project management, communication, and leadership skills are critical.

Qualifications:

Required Skills:

- 1 - 4 years engineering experience in a microelectronics manufacturing environment required

- B.S. degree in Electrical, Mechanical, Industrial, or Manufacturing Engineering required

- Familiarity with hybrid and MCM manufacturing methods required

- Basic understanding of problem solving methods, quality tools, and cost analysis

- Proven leadership

- Clear communication and documentation

 

Desired Skills:

- Direct experience with Product Engineering in a microelectronics environment

- Thorough understanding of hybrid and MCM manufacturing methods

- Demonstrated experience with problem solving methods, quality tools, and cost analysis

- Knowledge of BGA products (Design, Assembly, Test, and Quality)