Microelectronic Assembly Technician - Colorado

Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS: Ten (10) years or more hands-on experience in the microelectronic, hermetic packaging of custom hybrids (MCMs) or focal plane imaging devices. This technician must have experience in the following processing technologies: die attach; wire-bonding, ribbon-bonding; soldering and surface mount technology; adhesive technology; critical cleaning; precision optical assembly; assembly technique in a Class-100-cleanroom environment; critical cleaning, contamination control; seam-sealing; wafer/substrate sawing. In addition, skills in thin-film deposition and photolithographic thin film processing are desired. EDUCATIONAL REQUIREMENTS: Two-year associate degree in a technical field. In addition to the typical education and experience requirements, a demonstrated capability to adequately perform the essential functions and responsibilities of the position and exhibit the skills and competencies of the grade level should be considered. Each higher level degree; i.e., Master's Degree or Ph.D., may be substituted for two years of experience. Two years of experience may be substituted for each year of education. Key Words: detector packaging, focal plane packaging, imager assembly, MCM, hybrid, microwave, RF, electro-optic assembly, detectors, chip and wire. Equal Opportunity Employer M/F/D/V U. S. Citizenship or Permanent Residency is required. Please apply on line for immediate consideration at www.ballaerospace.com and type in job # 111350 after you click on the "Career" link. Thank you.