Advanced Packaging Engineer

Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for new products � Interface with equipment and materials suppliers, and perform equipment and materials evaluation � Transfer technologies and processes to volume manufacturing � Train engineers at volume manufacturing sites � Drive the resolution of critical production problems related to packaging � Provide inputs to packaging technology roadmap and design rules Requirements: � BS degree (MS or Ph.D. preferred) in mechanical engineering, materials science, physics or other related disciplines � Minimum 3 years hands-on experience in the packaging field Please Contact: Matt Langford F-O-R-T-U-N-E PERSONNEL CONSULTANTS of Huntsville 3311 Bob Wallace Avenue, Suite 204, Huntsville, Alabama 35805 (256) 534-7282 � (256) 534-7334 Fax matt@fpchuntsville.com FPC of Huntsville is a nationwide leader in the placement of executives, managers, and professionals within the electronics and automotive manufacturing industries. We are currently working on numerous searches in many different locations across North America. Please contact us or visit www.fpchuntsville.com for information on other opportunities.