Advanced Manufacturing Technology Engineer

Board Level Assembly BGA Expert!

We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company.

Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, with focus on the surface mount technology processes related to the board level assembly, inspection, and rework of ball grid arrays (BGA's).

Required Education or Equivalent: BS/BA
Desired Education: MS

Qualifications:

Must have extensive hands-on experience in the board level assembly of BGA's. Must have expertise in the processes, materials, and equipment related to board level BGA assembly.

Experience in the qualification (reliability testing) and manufacturing of hardware for high reliability military systems (avionics and/or space).

Direct experience with large, high pin count plastic BGA's (~800 to 1500 I/O) is highly desired.

Direct experience with ceramic type BGA's (column grid arrays, dimpled BGA's etc.)

Must be a hands-on engineer. In addition to having a solid intellectual understanding of the materials, processes, and technologies involved with the fabrication and board level assembly of BGA's, he/she must also have hands on experience with the application of the technical principles.

Demonstrated proficiency in the planning and execution of complex technical tasks and development projects is required.

Experience in working with Engineering teams, defining board level requirements, device footprints, plating requirements, solder mask requirements, etc.