POP, LGA, QFN Designing & Assembly Workshop

Package on Package (PoP) and LGA QFN applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers. In simple terms POP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. POP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. LGA QFN has provided process and quality engineers many challenges over the last couple of years but many of these issues have been addressed.PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy/Z height control process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.Each delegate will receive a FREE set of Package on Package inspection and quality control wall charts covering optical and x-ray inspection, dip flux and paste application, placement criteria and defects seen during assembly.Who should attend?

This event is ideally suited to design, production and quality engineers looking at future technology and maintaining a company technology roadmap. It’s vital to subcontractors to be up-to-date with new technology and its possible implementation along with material and equipment requirements for future customers.

Workshop topics include:

• What is Package on Package & LGA QFN?
• Component Standards
• Component Types
• JEDEC Standards
• PCB Design Rules
• Pad Layout
• Via Hole Connection
• Lead-Free Assembly
• Stencil Printing
• POP & LGA QFN Placement
• Tack Flux
• Dip Solder Paste
• Reflow Soldering
• Convection
• Vapour Phase
• Temperature Profiling
• Inspection
• Optical Inspection
• X-ray inspection
• Underfill
• Rework
• Package on Package Defects