37th International Symposium for Testing and Failure Analysis (ISTFA)

The Microelectronics Failure Analysis Event of the Year.

Share your experiences; advance the industry and your career at the premier event for the microelectronics failure analysis community.

The ISTFA technical symposia, user groups, education opportunities and the largest equipment exposition in the industry, make ISTFA the best place to learn, network and further your career.

Take advantage of:

• New Tutorials including: Construction Analysis and Reverse Engineering, Package FA, Chip Access and Repackaging,
• Delayering Techniques, Photovoltaic FA
• Technical Sessions including Counterfeit Electronics and Renewable Energy
• Technology-Specific User Groups include: Package and Assembly FA, 3D and Finding the Invisible Defect
• Panel Discussion “…But How Does One Find an ‘Invisible’ Defect?”
• Pre- and Post-Conference Education Short Courses
• North America’s Largest FA-Related Industry Show
• Exhibitor AfterHours Demonstrations
• Unlimited Networking Opportunities
• Significant Early-Bird and Housing Discounts

Keynote Presentation - Dr. Joseph Michael from Sandia

Be certain to arrive early for our keynote presentation by world renowned microscopist and ASM member Dr. Joseph Michael of Sandia National Laboratories. In keeping with our theme of “Finding the Invisible Defect”, Dr. Joseph Michael will present the work from him and his team on the tools and analysis used to identify the origins of the anthrax spores sent to our congressional representatives in Washington DC.

Technical Sessions:

• Alternative Energy (Photovoltaics, Solid State Lighting, etc.)
• Emerging FA Techniques and Concepts
• FA Process/Case Studies
• MEMS, Discretes and Optoelectronic Device FA
• Packaging and Assembly Level FA
• Finding Invisible Defects
• Defect Characterization & Metrology
• Test and Diagnosis
• Circuit Edit (Laser, FIB, etc.)
• Counterfeit Electronics Detection and Mitigation
• Photon Based Fault Isolation Techniques
• Sample Preparation and Device Deprocessing
• Nanoprobing and Electrical Characterization
• Panel Discussion on ‘But How Do You Find an “Invisible” Defect?

Tutorial Program - November 13 - 14, 2011

The ISTFA 2011 Tutorial is a comprehensive series of lectures designed to provide in-depth coverage of key topics relating to failure analysis, including critical focus areas such as fault localization, FIB, and microscopy.

Tutorial Topics:

• Lab Management
• Fault Localization
• Package and Physical Analysis Challenges
• Microscopy Techniques  Technology Specific FA
• FIB
• FA Allied Topics