IPC High Reliability Forum




Tue, May 15 - Thu, May 17, 2018


Baltimore, Maryland


The IPC High Reliability Forum will focus on electronics used for Mil-Aero and automotive sectors subjected to harsh use environments.  

Topics of discussion include:

  • HDI Microvia Reliability for any Temperature Extreme
  • System-level effects on Solder Joint Reliability
  • How MSI Applied Technology Beat the Microvia Hidden Threat
  • Microvia Reliability
  • Reliability Coupons
  • Revisions to IPC 6012 Standard: Test Coupons, Test Boards and Reflow Testing

The program will kick-off with a half day tutorial: Achieving Improved Reliability with Failure Analysis which will be presented by Bhanu Sood, Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center.

The event will include a special presentation on the results from the DOC study on the Printed Circuit Board Industry and a featured panel discussion: Forgotten Tribal Knowledge addressing: conformal coating reliability, use of material combinations, stripping off gold from components and why it’s important and how materials are made affect reliability.

The event will include presentations from the following companies:

  • i3 Electronics
  • American Standard Circuits
  • Conductor Analysis Technologies, Inc.
  • DfR Solutions
  • Honeywell Aerospace
  • Lockheed Martin Missiles and Fire Control
  • Motorola
  • Raytheon
  • RBP Chemical
  • SAIC



Nov 13, 2018

Schaumburg (Chicago), Illinois

IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference

Jan 29, 2019

San Diego, California


See full schedule »

Facility Closure

Reflow Ovens thermal process improvement

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