Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial


Online Events


Tue, July 17 - Wed, July 18, 2018


Two 90 minute Sessions, July 17 and 18, 2018 1:00pm to 2:30pm Eastern, Presented by: John Hunt, ASE (US) Inc.

Mobile electronics has driven the need for ever increasing density and performance in electronics packaging. This has only accelerated with the advent of advanced smart phones and the burgeoning Internet of Things. This evolution has led to a need for higher levels of component density and functionality than has been traditionally available using standard packaging, resulting in a wide variety of new packaging options.

We will review how the integration of wafer level processing technologies, substrate evolution and Flip Chip packaging structures have come together into what is being called Fan Out Packaging. These packages are for both low density mobile and high density server applications. They have higher levels of integration and sophistication than has ever been possible in the past. These options include Wafer Level Fan Out, Panel Level Fan Out, and Chip Last Fan Out packaging. All of these can combine low cost materials and varied process flows to create both simple devices, and more complex System in Package and Package on Package applications. This course will provide an overview of the drivers, technology, advantages and disadvantages of various structural options, as well as a view of potential future trends for Fan Out Packaging.

Course Outline:

1. Evolution to Fan Out
     a. WLCSP
     b. Fan Out
2. Drivers for Fan Out
     a. Historical Drivers
     b. Advanced Drivers
3. Definition of “Fan Out”
4. Advantages of Fan Out
5. Fan Out Market
     a. Forecast
     b. Low Density vs High Density
6. Brief History of Fanout
     a. Early Variations
7. 2D Fan Out Structures
     a. Low Density 2D Fan Out
     b. High Density 2D Fan Out
8. Fan Out System in Package (SiP)
     a. Passive Components in Fan Out
     b. 3D Interconnectivity Structures
9. 3D Fan Out Structures
     a. Low Density 3D Fan Out
     b. High Density 3D Fan Out
10. Comparison of Fan Out Technologies
11. Reliability Considerations
     a. Structural Reliability Variations
12. Panel Fan Out
     a. Drivers
     b. Considerations


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