Electronic Manufacturing Exchange #156 Auction

By Order of Leading Global Electronic OEMs, Semiconductor, and Electronic Manufacturing Services (EMS) Companies

Electronics manufacturing monthly auction featuring semiconductor fabrication, test & measurement from a World Class Semiconductor Manufacturer, Philips, TE Connectivity, Continental, and other global sellers

Featuring:

Philips - San Jose, CA

• (2) CHA Industries SE-600-RAP Ion Beam Evaporator
• (2) Canon/Neutronics PLA-501 Mask Aligner
• Karl Suss 12300039 Contact Aligner
• Trion Oracle ICP Etch System
• Trion Oracle ICP Etch Cluster Tool
• SpeedFam 32BTAW 32" Lapper
• SpeedFam 32SPAW 32" Lapper
• SpeedFam 32DGW 32" Lapper

TE Connectivity - Mansfield, OH

• Faro F04 Gage Plus Robotic Arm / Portable CMM

Continental - Dearborn, MI

• Sikama Falcon 8500 Reflow Solder/Curing Oven
• ATV Technologies SRO-706 Vacuum Reflow Oven
• Essemtec FLX2010 Pick & Place Machine
• Trek Triton Aqueous Electronics Assembly Cleaning System
• Speedprint SP100 Solder/Screen Printer
• (3) Orthodyne Electronics M360C Wire Bonder
• (3) Blue M DC-136-C-MP550 Electric Oven

World Class Semiconductor Manufacturer - Hayward, CA

• Axcelis Fusion ES3 Dual-Chamber Plasma Asher, 300mm
• ThermaWave OptiProbe 2600B Film Measurement System
• KLA Tencor 2132 Wafer Inspection System
• M+W Zander / Steag HamaTech 9280000 Advanced Single Substrate Processor
• Agilent 1100 Series HPLC
• BOC Edwards iH1800 Vacuum Pump System
• BOC Edwards iH1000 Vacuum Pump System
• (8) BOC Edwards iH600 & iL600 Vacuum Pump Systems
• (2) BOC Edwards iQDP80/QDP1200 Vacuum Pump Systems
• (8) BOC Edwards iQDP80/QDP250 Vacuum Pump Systems
• (10) BOC Edwards iL70N Vacuum Pump Systems
• (2000+) 300mm FOSBs (front-opening shipping boxes)