SPIE - International Society for Optical Engineering
An international society advancing an interdisciplinary approach to the science and application of light.
SPIE - The International Society for Optical Engineering is dedicated to advancing scientific, research, and engineering applications of optical, photonic, imaging, and optoelectronic technologies through its meetings, education programs, and publications.
SPIE is the international society for optics and photonics founded in 1955 to advance light-based technologies. Serving more than 177,000 constituents from 168 countries, the Society advances emerging technologies through interdisciplinary information exchange, continuing education, publications, patent precedent, and career and professional growth.
SPIE annually organizes and sponsors approximately 25 major technical forums, exhibitions, and education programs in North America, Europe, Asia, and the South Pacific.
In 2009, the Society provided more than $2 million in support of scholarships, grants, and other education programs around the world.
SPIE publishes the SPIE Digital Library, containing more than 296,000 research papers from the Proceedings of SPIE and the Society's 9 scholarly journals with around 18,000 new papers added each year, and more than 120 eBooks from the SPIE Press catalog. The SPIE Press publishes print monographs, tutorial texts, Field Guides, and reference books. SPIE also publishes a wide variety of open access content.
Membership includes Fellows and Senior Member programs. The Society has named more than 840 SPIE members as Fellows since 1955, and implemented its Senior Member program in 2008.
SPIE's awards program serves to recognize outstanding contributions from individuals throughout the scientific community regardless of membership status.
SPIE - International Society for Optical Engineering Postings
2 technical articles »
Conductive Adhesives Increase Microchip Packaging Density
Jun 24, 2010 | Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, and Maaike M.V. Taklo
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost....
Next-Generation Test Equipment For High-Volume Wafer Production
Jun 23, 2010 | Kay Gastinger, Odd Løvhaugen
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area. ...
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