Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

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Insufficient Solder Paste

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#38317

Insufficient Solder Paste | 8 December, 2005

We are encountering insufficient solder paste. Our stencil thickness is 0.13 mm and our printing pressure is 0.08 MPa our solder paste is Tamura TLF-204-19A. Please advice how to solve this problem.

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#38326

Insufficient Solder Paste | 8 December, 2005

Questions are: * Is the stencil design proper to provide the correct amount of solder paste? * Is the stencil design proper to provide for release of solder paste? * Is solder paste filling the stencil aperatures, prior to separation? * Are stencil aperatures open / not clogged with dried paste? * After separtion, is the paste on the board or the stencil?

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