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Loctite as BGA underfill for lead free process?

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#38156

Loctite as BGA underfill for lead free process? | 1 December, 2005

Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process since curing is almost same with solder melting point at 183C. How about for lead-free process wherein peak temp reach 217C any adhesive that can be recommended so as to support the auto-alignment of BGA during reflow stage?

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